Programmable Junction Temperature Design for FPGA Reliability
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Solution Overview
Problem
Existing integrated circuit (IC) designs, particularly field programmable gate arrays (FPGAs), are often over-engineered to meet conservative worst-case reliability assumptions, leading to increased die size, cost, and design time due to stringent temperature and power usage requirements, which may not align with actual usage conditions.
Innovation Solution
A circuit design tool calculates reliability based on anticipated use conditions, determining a maximum junction temperature and power distribution at a granular level, allowing for reduced maximum junction temperatures and power usage, and adjusts the design to achieve a desired defects rate, thereby optimizing IC performance and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conservative worst-case reliability assumptions are used to design ICs, then reliability is improved, but die size and cost increase
Solution Approach 1:
The patent applies parameter changes by transitioning from fixed conservative temperature assumptions to dynamic, usage-condition-based temperature calculations. The system calculates actual maximum junction temperatures based on specific circuit designs and usage patterns, allowing the temperature parameter to vary rather than remaining fixed at conservative values. This enables smaller dies to achieve the same reliability by using lower actual operating temperatures than the conservative worst-case assumptions would require.
2Reliability
If conservative worst-case reliability assumptions are used to design ICs, then reliability is improved, but design time increases
Solution Approach 1:
The patent implements feedback by creating an iterative design process where the calculated maximum junction temperature feeds back into the reliability assessment. The system calculates temperature based on the circuit design and usage conditions, compares this against reliability targets, and adjusts the design accordingly. This feedback loop eliminates the need for overly conservative design margins and reduces design time by allowing more precise, usage-specific reliability optimization rather than relying on fixed conservative assumptions.
3Area of stationary object
If higher maximum junction temperatures are used, then die size can be reduced, but thermal management becomes more challenging
Solution Approach 1:
The patent applies local quality by calculating and managing temperature at the granular level of individual circuit blocks rather than using a single uniform maximum junction temperature for the entire die. Each circuit block can have its own temperature calculation based on its specific power consumption and usage conditions, allowing different regions of the die to operate at different temperature levels. This enables more efficient thermal management that accommodates varied temperature requirements across different parts of the die, potentially allowing smaller overall die sizes while maintaining reliability.
Data Source
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AI summary
Systems and methods are provided for generating a circuit design for an integrated circuit using a circuit design tool. The circuit design tool determines maximum junction temperatures for circuit blocks in the circuit design for the integrated circuit. The circuit design tool determines defects values for the circuit blocks using the maximum junction temperatures for the circuit blocks. The circuit design tool determines a defects value for the circuit design based on the defects values for the circuit blocks. The circuit design tool determines a maximum junction temperature for the circuit design based on a comparison between the defects value for the circuit design and a target defects value for the circuit design. The circuit design tool can dynamically reconfigure configurable logic circuit blocks to improve the power, the performance, and the thermal profile to achieve an optimal junction temperature per circuit block.