Juxtaposed Contact Welding for Slim USB Memory Card Assembly

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Solution Overview

Problem

The existing welding processes for USB slim memory cards can damage electronic components due to thermal effects, leading to dislocation and reduced product yield, and most card memory devices are manufactured using semiconductor methods that limit the production of non-flat metallic pads.

Innovation Solution

A card structure design featuring juxtaposed contact points on adjacent peripheral portions of two elements, which are snugly welded or glued, eliminating thermal damage and allowing for different manufacturing procedures to produce connectors and electrical circuits with reduced dimensions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If welding process is used to connect COB and connector, then electrical connection is achieved, but thermal effect damages electronic parts and chips

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidthermal damage to electronic parts

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the connection structure into two separate elements: a COB element with contact points and a connector element with corresponding contact points. These elements are joined adjacent to each other without direct welding between the COB and connector, segmenting the welding process from the electronic components to eliminate thermal damage while maintaining electrical connection reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediate structure (the second element/connector element) that mediates between the COB and the final connector. The contact points are juxtaposed and connected through this intermediate structure, allowing electrical connection without subjecting the electronic parts to welding heat.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If semiconductor manufacturing process is used, then flat metallic pads can be produced, but non-flat metallic pads cannot be produced

Engineering Contradiction:

Improveproduction capabilityVSAvoidpad geometry flexibility

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

Instead of forming complex non-flat pads through complex semiconductor processes, the patent inverts the approach by creating the pad structure through the joining of two elements with adjacent peripheral portions. The non-flat geometry is achieved through the structural arrangement rather than through pad formation processes, enabling versatility in pad geometry while maintaining ease of manufacture.

Inventive Principle:

Principle #13The other way round (Inversion)

3Ease of manufacture

If traditional card structure is used, then manufacturing is straightforward, but product dimension cannot be reduced

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidcard dimension

Core Design Contradiction:

Ease of manufactureVSLength of moving object

Solution Approach 1:

The patent transitions from a traditional single-element card structure to a two-element structure where contact points are juxtaposed in adjacent peripheral portions. This dimensional reorganization allows for more efficient space utilization and reduced overall card dimensions while maintaining manufacturing simplicity through the modular joining process.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design prevents thermal damage to electronic components during welding, increases product yield, and enables the production of connectors and electrical circuits with enhanced functionality and reduced dimensions.

Implementation Method 1

these juxtaposed contact points are snugly welded or glued by an associated mechanism

Methodology Applied

Scientific EffectWelding: Welding

Implementation Method 2

these juxtaposed contact points are snugly welded or glued by an associated mechanism

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS8687373B2Card structure, socket structure, and assembly structure thereof

Publication Date: 2014.04.01 IND TECH RES INST

AI summary

A card structure includes a first element and a second element. The first element includes a first peripheral portion and a plurality of first contact points exposed by the first peripheral portion. The second element includes a second peripheral portion and a plurality of second contact points corresponding to the first contact points of the first element and exposed by the second peripheral portion. When the first and second elements are joined with each other, the first peripheral portion of the first element and the second peripheral portion of the second element are adjacent to each other, to juxtapose the first contact points of the first element and the second contact points of the second element to each other. The juxtaposed first and second contact points of the first and second elements are coupled to each other by a welding portion.