Kelvin Contact Assembly Modular Installation

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Solution Overview

Problem

Kelvin contact assemblies in integrated circuit testing apparatuses face challenges with high accumulated tolerances, complex installation processes, uneven kelvin gaps, over-wiping issues, and pin co-planarity problems due to cantilever contact designs.

Innovation Solution

An electrical contact assembly comprising four identical modules with a bottom and top housing, featuring through holes of different heights to facilitate easier installation and using conductive wires shaped to eliminate tolerance issues, ensuring controlled kelvin gaps and reduced machining tolerances.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If cantilever type contacts are used, then the contact structure is simple, but high accumulated tolerances make assembly for fine pitching difficult

Engineering Contradiction:
Improvecontact structure complexityVSAvoidassembly precision for fine pitching
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The contact assembly is divided into multiple modular units, each containing a subset of contacts. This segmentation allows for pre-assembly and quality control of individual modules before final integration, reducing cumulative tolerance effects and improving overall assembly precision for fine pitching applications

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from traditional planar contact arrangements to a three-dimensional configuration where contacts are positioned at different heights and angles. This dimensional change enables better tolerance compensation and achieves finer pitch accuracy by utilizing vertical and angular degrees of freedom in addition to horizontal positioning

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If housings are used to secure the cantilever contacts, then the contacts are secured, but the assembly becomes complex and difficult to install

Engineering Contradiction:
Improvecontact securing reliabilityVSAvoidassembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The housing structure is merged with the contact support function, eliminating the need for separate securing mechanisms. The housing itself is designed to provide both structural support and contact retention through integrated features, simplifying the overall assembly while maintaining secure contact positioning

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The contact assembly features self-aligning and self-securing mechanisms where the contacts automatically position themselves within the housing during installation. The design includes self-centering features and interference-fit elements that automatically secure contacts without requiring additional fastening steps or complex assembly procedures

Inventive Principle:
Principle #25Self-service

3Device complexity

If cantilever contact designs are used, then the contact structure is straightforward, but they produce wide tolerances that lead to uneven kelvin gaps and over-wiping issues

Engineering Contradiction:
Improvecontact design complexityVSAvoidkelvin gap uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent changes the geometric parameters of the contact structure, specifically transitioning from long cantilever beams to shorter, stiffer contact elements with optimized length-to-width ratios. This parameter change reduces deflection under load and minimizes tolerance accumulation, resulting in more uniform kelvin gaps and elimination of over-wiping issues

Inventive Principle:
Principle #35Parameter changes

4Ease of manufacture

If cantilever pins are cut to shape, then the contacts are formed, but this creates tolerance distributions that contribute to unevenness or piano effect

Engineering Contradiction:
Improvecontact formation easeVSAvoidpin co-planarity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The contact pins are pre-formed with precise geometry and co-planarity before final assembly. The manufacturing process includes preliminary precision machining or forming operations that establish the final contact surface geometry, followed by careful positioning and securing in the housing to maintain the pre-established co-planarity and eliminate piano effect

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS10527646B2Kelvin contact assembly and method of installation thereof
Publication Date: 2020.01.07 JF MICROTECH
  • US10527646B2 patent drawing
  • US10527646B2 patent drawing
  • US10527646B2 patent drawing

AI summary

An electrical contact assembly comprised of four identical modules arranged in a four-sided formation. Each module comprises of a bottom housing formed with two rows of through holes to allow a row of front and back contact pairs to be inserted, with separators in between each pair to prevent electrical conductance between the pairs. A top housing is then lowered onto the top of these contact pairs. With the aid of a key tool, the rows of contact pairs are inserted into through holes in the top housing. By virtue of different heights between the front and back rows of through holes, the front and back contact rows are inserted one first, and then the other. This allows for easier installation of an assembly with minimal tolerance accumulation.