Power Electronics Package With Independent Kelvin and Power Loops
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Solution Overview
Problem
Conventional discrete power packages experience reduced switching quality, slower switching speeds, and potential destruction of power semiconductor die due to coupling between power and signal loops, which complicates layout and introduces reliability concerns.
Innovation Solution
A discrete package design with a power substrate, power semiconductor die, and a Kelvin connection contact, where the Kelvin connection pad is directly coupled to the Kelvin connection contact via a conductive trace on the substrate, simplifying layout and reducing connection lengths, thereby maintaining the independence of power and signal loops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the second power switching contact and Kelvin connection contact are coupled together before connecting to power semiconductor die, then the layout is simplified, but coupling between power switching loop and signal loop is introduced causing feedback
Solution Approach 1:
The patent segments the connection paths by providing separate conductive traces for the second power switching contact and the Kelvin connection contact on the power substrate. This segmentation prevents the coupling of power and signal loops while maintaining layout simplicity, as each trace can be independently routed to its respective connection point without interfering with the other.
Solution Approach 2:
The power substrate acts as an intermediary element that receives both the second power switching contact and the Kelvin connection contact as separate inputs and distributes them to the power semiconductor die through distinct conductive traces. This intermediary structure enables independent routing paths that prevent feedback coupling while simplifying the overall package layout.
2Adaptability or versatility
If longer connections are used between Kelvin connection contact and power semiconductor die, then layout flexibility is improved, but switching performance deteriorates due to increased inductance and coupling
Solution Approach 1:
The patent utilizes the two-dimensional surface of the power substrate to route conductive traces in optimized paths that minimize length while maintaining layout flexibility. By planning trace routes in both horizontal and vertical dimensions on the substrate surface, the design achieves short connection lengths without compromising adaptability to different package configurations.
Solution Approach 2:
The patent optimizes the electrical parameters of the conductive traces by controlling their geometry, width, and routing patterns on the power substrate. These parameter adjustments minimize trace inductance and length while preserving layout flexibility, thereby maintaining high switching speed performance despite the need for adaptability in different application scenarios.
3Reliability
If metal connections are provided between second power switching contact and Kelvin connection contact, then electrical coupling is achieved, but impedance is introduced causing feedback between loops
Solution Approach 1:
The patent merges the functions of electrical connection and loop isolation by using the power substrate's conductive trace system to simultaneously provide separate paths for power and signal connections. The traces are designed to connect the second power switching contact and Kelvin connection contact to the power semiconductor die while maintaining electrical isolation between the power switching loop and signal loop, eliminating the need for additional isolating components.
Data Source
AI summary
A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.