Kelvin Contact Pad Layout for Compact Electronic Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic device packaging technologies face challenges in reducing contact resistance while maintaining the size constraints necessary for Kelvin contacting, which is crucial for precise resistance and voltage measurements, and often require costly probing and sensitive test setups.
Innovation Solution
The electronic device package employs a geometric arrangement of connection pads on a laminate substrate, allowing for Kelvin contacting with reduced overall footprint, utilizing a 2x2 mm layout with 16 connection pads of specific dimensions and orientations, and includes signal routing layers for efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging structures are used, then structural support is provided, but contact resistance is high and Kelvin contacting cannot be achieved
Solution Approach 1:
The packaging structure is segmented into distinct functional zones: connection pads positioned at perimeter locations for electrical contact, a central region for the die, and exposed paddle areas for thermal and electrical connection. This segmentation allows Kelvin contacting by separating current path and voltage sense paths through different pad configurations at specific perimeter locations.
Solution Approach 2:
The laminate substrate acts as an intermediary element that provides controlled impedance traces and isolation structures between the die and external connection pads. The substrate's internal layer structure mediates the electrical connection, enabling Kelvin sensing by providing dedicated return paths and isolating measurement signals from ground references.
2Measurement precision
If connection pads are made larger for Kelvin sensing, then measurement precision improves, but package footprint increases
Solution Approach 1:
The connection pads are positioned at perimeter locations of the package rather than requiring large central areas. By utilizing the peripheral dimension of the package footprint, adequate pad sizes for Kelvin sensing are achieved without increasing the overall package area, as pads are distributed around the boundary rather than concentrated in the center.
Solution Approach 2:
Different regions of the package are assigned different functions: perimeter locations host connection pads with specific dimensions optimized for Kelvin sensing, while the central region accommodates the die. This local differentiation allows connection pads to have sufficient size for accurate measurement without requiring the entire package to be large.
3Productivity
If connection pads are positioned close to die for compact layout, then productivity improves, but manufacturing precision requirements increase
Solution Approach 1:
The laminate substrate provides controlled impedance traces that maintain equipotential relationships between connection pads and die contact points. By designing the substrate with predetermined trace geometries and material properties, the electrical potential distribution is controlled, allowing compact pad spacing while maintaining signal integrity and reducing sensitivity to positioning variations.
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~2
AI summary
Aspects of the disclosure relate to an electronic device package. The electronic device package can include a laminate substrate. The electronic device package can include connection pads disposed on the laminate substrate and along a perimeter of the electronic device package. Connection pads that are along a first side of the laminate substrate can have a first orientation that is different than a second orientation of connection pads that are along a second side of the laminate substrate. The first side can be adjacent to the second side. Each of connection pads can have a minimum size for Kelvin sensing in a process technology for manufacturing the electronic device package. The electronic device package can include a die enclosed within a packaging structure.