Kerf Framing Structure for Crack Prevention in Semiconductor Dicing
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Solution Overview
Problem
The existing methods for manufacturing semiconductor wafers often result in cracks and chipping during the dicing process due to the propagation of cracks along the kerf, which can compromise the integrity of the integrated circuits and require additional manufacturing steps.
Innovation Solution
The introduction of a kerf framing structure, comprising a material structure arranged adjacent to the chips in the kerf, which mirrors the seal rings and is formed using the same layer stack as the metallization layers, to provide an additional barrier against crack propagation and reduce chipping during the dicing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional dicing methods are used without kerf framing, then the manufacturing process is simple and fast, but cracks propagate along the kerf causing chipping and compromising chip integrity
Solution Approach 1:
The kerf framing structure is formed in advance during the metallization process, creating a protective barrier before the dicing operation. This preliminary action prevents cracks from propagating into the chip inner regions during subsequent sawing, thereby improving chip integrity without requiring additional post-dicing repair steps
Solution Approach 2:
The kerf framing acts as an intermediary structure between the kerf and the chip inner region. It serves as a crack stop barrier that intercepts and blocks crack propagation, protecting the chip from damage while allowing the dicing process to proceed. The framing is positioned in the kerf adjacent to the chip, creating a buffer zone that prevents direct crack transmission
2Reliability
If kerf framing is added to prevent crack propagation, then chip integrity is improved, but additional manufacturing steps and costs are required
Solution Approach 1:
The kerf framing formation is merged with the existing metallization process by using the same layer stack and photomask set. The framing is created alongside the chip metallization layers without requiring separate deposition or patterning steps, thereby improving chip integrity while avoiding additional manufacturing complexity
Solution Approach 2:
The same photomask set used for chip metallization patterning is also used to define the kerf framing pattern. This universal approach allows the framing to be created using existing process tools and parameters, eliminating the need for dedicated framing fabrication equipment or procedures while still providing effective crack protection
3Reliability
If kerf framing is formed with additional material layers, then crack propagation is blocked, but manufacturing precision requirements increase
Solution Approach 1:
The kerf framing utilizes the same photomask set and patterning process as the chip metallization layers. This ensures that the framing is automatically aligned with the chip structure using the existing precision registration system, eliminating the need for separate alignment procedures while still providing effective crack propagation blocking
Data Source
AI summary
A method for manufacturing a chip is disclosed. The method comprises forming a material structure in a kerf adjacent the chip on a wafer. The method further comprises selectively removing the material structure in the kerf and dicing the wafer.A semiconductor wafer is disclosed. The semiconductor wafer comprises a plurality of chips and a plurality of kerfs. The kerfs separate the chips from each other. At least one kerf comprises a kerf framing. The kerf framing is arranged directly adjacent a side of the at least on chip.