Kerf Junction Crack Stop Barrier for Semiconductor Dicing

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Solution Overview

Problem

Conventional crack stop rings in semiconductor wafers fail to prevent crack propagation at chip corners during dicing, leading to potential damage of integrated circuits and contamination.

Innovation Solution

Incorporating crack stop barriers in the kerf junctions, arranged parallel or orthogonal to the scribe lines, which can be continuous, staggered, or jagged lines made of conductive or dielectric materials, to block crack propagation along specific directions and protect the integrated circuit regions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional crack stop rings are used in semiconductor wafers, then chip separation is enabled, but crack propagation at chip corners cannot be prevented

Engineering Contradiction:

Improvecrack preventionVSAvoidkerf structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The crack stop barrier is segmented into multiple sections positioned at different locations within the kerf, including at least one section within 5 micrometers of a chip corner. This segmentation allows the barrier to effectively block crack propagation paths that conventional single-ring structures cannot prevent, particularly at vulnerable corner regions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The crack stop barrier features varying widths at different sections, with at least one section having a width greater than 5 micrometers. This local quality variation provides enhanced crack stopping capability at critical locations (near chip corners) while maintaining appropriate barrier dimensions in other regions, optimizing both effectiveness and manufacturing feasibility.

Inventive Principle:

Principle #3Local quality

2Reliability

If crack stop barriers are added to protect integrated circuit regions, then device failure risk is reduced, but manufacturing process complexity increases

Engineering Contradiction:

Improvedevice failure preventionVSAvoidkerf fabrication

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The crack stop barrier is formed as part of the kerf structure before chip separation occurs. The barrier is created during the dicing process itself, with the saw blade removing material to form both the separation kerf and the crack stop barrier simultaneously. This preliminary formation eliminates the need for separate barrier fabrication steps after dicing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The crack stop barrier serves as an intermediary structure within the kerf that mediates between the cutting process and the chip integrity. Made from kerf material or deposited during dicing, the barrier intercepts and blocks crack propagation from the kerf into the integrated circuit regions, protecting the chips without requiring additional post-processing steps.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10438903B2Crack stop barrier and method of manufacturing thereof

Publication Date: 2019.10.08 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor device includes a chip, a first kerf adjacent the chip and having a first main direction, a second kerf adjacent the chip and having a second main direction. A kerf junction is formed by the first kerf and the second kerf. A crack stop barrier is located along a first portion of a perimeter of the kerf junction.