Ketone-Based Cleaning Composition for Semiconductor Adhesive Residue Removal
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Solution Overview
Problem
The increasing density of electrode terminals in semiconductor devices requires effective methods to maintain electrical characteristics during substrate processing, particularly in removing adhesive residues without damaging solder balls or pads.
Innovation Solution
A cleaning composition comprising a solvent with a ketone compound content of 40 wt % to 90 wt %, quaternary ammonium salt, and primary amine is applied to semiconductor substrates to efficiently remove adhesive layer residues, preventing damage to solder balls and pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning methods are used to remove adhesive residues, then the adhesive layer can be removed, but solder balls and pads may be damaged
Solution Approach 1:
The patent changes the chemical parameters of the cleaning composition by specifying precise proportions of ketone compounds (40-90 wt%), quaternary ammonium salts (5-60 wt%), and primary amines (5-60 wt%). This optimized composition achieves effective adhesive removal while preventing damage to sensitive components like solder balls and pads, resolving the contradiction between cleaning effectiveness and component safety
Solution Approach 2:
The cleaning composition uses a composite chemical formulation combining ketone compounds, quaternary ammonium salts, and primary amines in specific ratios. This composite approach leverages the synergistic effects of different chemical components to achieve both thorough adhesive residue removal and protection of solder balls and pads, eliminating the need for harsh conventional cleaners
2Productivity
If the number of electrode terminals is increased and pitch is reduced, then device integration is improved, but maintaining electrical characteristics during processing becomes more difficult
Solution Approach 1:
The patent controls the chemical parameters of the cleaning composition (ketone 40-90 wt%, quaternary ammonium salt 5-60 wt%, primary amine 5-60 wt%) to achieve optimal cleaning effectiveness. This precise parameter control allows for complete adhesive removal without damaging the densely packed electrode terminals and pads, thereby maintaining electrical characteristics while supporting high integration density
Solution Approach 2:
The cleaning composition creates a controlled chemical environment that mimics ideal cleaning conditions - effective enough to remove all adhesive residues but gentle enough to preserve the integrity of densely packed electrical components. This balanced approach enables processing of high-density interconnect structures without compromising electrical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning composition effectively removes adhesive residues, improving the yield of semiconductor devices by maintaining electrical characteristics and preventing damage to sensitive components.
Implementation Method 1
a solvent including a ketone compound and having a content that is equal to or greater than 40 wt % and less than 90 wt %
Implementation Method 2
quaternary ammonium salt, and primary amine
Data Source
AI summary
Embodiments of the inventive concepts provide a method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer. The method includes preparing a semiconductor substrate to which an adhesive layer adheres, removing the adhesive layer from the semiconductor substrate, and applying a cleaning composition to the semiconductor substrate to remove a residue of the adhesive layer. The cleaning composition includes a solvent including a ketone compound and having a content that is equal to or greater than 40 wt % and less thaadminn 90 wt %, quaternary ammonium salt, and primary amine.