Key Module Pivot Stability via Film Layer Support

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Solution Overview

Problem

Key modules in existing technologies tend to wobble and produce noise due to gaps between the pivots of the scissor structure and the bracket pivotal portion, caused by tolerance, leading to unwanted contact and noise generation when the keycap is pressed.

Innovation Solution

A key module design featuring a circuit film assembly with supporting portions formed by film layers that extend to the side of the bracket pivotal portion, supporting the first pivot and allowing it to continuously contact the bracket pivotal portion, eliminating the gap and stabilizing the pivot's position.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a gap is provided between the pivots of the scissor structure and the bracket pivotal portion due to tolerance, then the key module can accommodate manufacturing variations, but the key module may wobble easily and produce noise

Engineering Contradiction:
Improvetolerance accommodationVSAvoidkey module stability
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent introduces a buffer element as an intermediary component between the pivot and the bracket pivotal portion. This buffer fills the gap caused by tolerance, preventing the pivot from directly contacting the bracket pivotal portion. The buffer acts as a mediator that maintains continuous contact while accommodating manufacturing variations, thereby eliminating wobble and noise without compromising tolerance adaptability

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the first pivot is supported by the supporting portion formed by film layers, then the first pivot continuously contacts the bracket pivotal portion eliminating gaps, but the structure complexity increases

Engineering Contradiction:
Improvecontact continuityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent utilizes a supporting portion formed by flexible film layers to support the first pivot. The film layers deform elastically to maintain continuous contact between the pivot and the bracket pivotal portion while accommodating manufacturing tolerances. This approach achieves reliable continuous contact without adding complex mechanical structures, as the flexible film inherently provides the necessary support and adaptation

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS11640883B2Key module
Publication Date: 2023.05.02 CHICONY ELECTRONICS CO LTD
  • US11640883B2 patent drawing
  • US11640883B2 patent drawing
  • US11640883B2 patent drawing

AI summary

A key module includes a bracket, a circuit film assembly, a keycap, and a connecting structure. The bracket includes a bottom plate and a bracket pivotal portion protruding from the bottom plate. The circuit film assembly is disposed on the bracket and includes a plurality of film layers and a supporting portion formed by at least one of the film layers. The supporting portion is located beside the bracket pivotal portion. The keycap is disposed above the bracket and the circuit film assembly and includes a keycap pivotal portion. The connecting structure is disposed between the bracket and the keycap and includes a first pivot pivotally disposed at the bracket pivotal portion and a second pivot pivotally disposed at the keycap pivotal portion. The supporting portion beside the bracket pivotal portion supports the first pivot, such that the first pivot continuously contacts the bracket pivotal portion.