Key Structure with Exposed Conductive Layers
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Solution Overview
Problem
Current membrane switches in keyboard structures face challenges in reducing thickness due to the thickness of polyethylene terephthalate (PET) material layers and require multiple bonding processes with waterproof glue, limiting yield and increasing production costs, especially when modifying the size of openings in the middle layer.
Innovation Solution
A key structure design using two membranes with conductive and insulation layers, where the conductive layers are exposed through openings in the insulation layers, allowing for conduction upon pressing, reducing the number of layers and eliminating the need for new molds when modifying openings, thus reducing thickness and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If three layers of insulation membranes are used with waterproof glue bonding, then the structural integrity and waterproofing are improved, but the thickness of the membrane switch increases and production complexity increases
Solution Approach 1:
The patent removes the middle insulation membrane from the traditional three-layer structure, extracting only the essential functional layers (first membrane with conductive layer, second membrane with conductive layer) while eliminating redundant layers. This reduces thickness while maintaining the core switching function through direct conductive layer contact upon pressing.
Solution Approach 2:
The patent combines the insulation and conductive functions into integrated layers. The first and second membranes each have conductive layers that serve both as structural elements and as the switching mechanism, eliminating the need for separate middle insulation membrane and reducing the number of bonding processes required.
2Reliability
If three layers of insulation membranes with waterproof glue are used, then waterproofing is improved, but the number of bonding processes increases and production yield cannot be improved
Solution Approach 1:
The patent extracts and eliminates the middle insulation membrane layer, reducing the number of bonding interfaces from two (between three layers) to one (between two layers). This single bonding process simplifies production, improves yield, and maintains waterproofing through the integrated design of the remaining layers.
Solution Approach 2:
The patent merges the insulation and conductive functions into the first and second membrane layers, creating integrated structures that require fewer bonding processes. The conductive layers are formed directly on the membrane surfaces, reducing the number of separate manufacturing steps and improving production efficiency.
3Adaptability or versatility
If the size of the opening in the middle layer of insulation membrane needs to be changed, then adaptability is improved, but a new mold needs to be opened increasing production costs
Solution Approach 1:
The patent removes the middle insulation membrane that traditionally required mold changes for opening size modifications. By eliminating this layer and forming conductive layers directly on the first and second membranes, the design allows opening sizes to be adjusted through simpler processes without requiring new molds, reducing production costs while maintaining adaptability.
Solution Approach 2:
The patent enables opening size modifications by changing parameters in the patterning process of the conductive layers on the first and second membranes. This approach allows flexible adjustment of opening dimensions through process parameter changes rather than requiring physical mold changes, reducing manufacturing costs while maintaining design adaptability.
4Reliability
If two bonding processes with waterproof glue are used, then waterproofing is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent extracts and eliminates the middle insulation membrane, reducing the number of bonding interfaces from two to one. This single bonding process between the first and second membranes simplifies the manufacturing process while maintaining waterproofing through the integrated design of the remaining layers and their conductive structures.
Solution Approach 2:
The patent merges the insulation and conductive functions into integrated membrane layers, reducing the number of separate components and bonding processes. The conductive layers are formed directly on the membrane surfaces, consolidating manufacturing steps and reducing process complexity while maintaining the necessary waterproofing performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the thickness of the key structure and improves yield by using only two layers of membranes, allowing for easier modification of openings without new molds, thereby lowering production costs.
Implementation Method 1
when the first membrane in the pressing area is pressed, the first conductive layer can move toward the second membrane along with the bending deformation of the first membrane to enter into contact with the second conductive layer
Data Source
AI summary
A key structure having a pressing area is provided. The key structure includes a first membrane and a second membrane. A first conductive layer and a first insulation layer are sequentially disposed on a surface of the first membrane. The first insulation layer has a first opening in the pressing area, so that a part of the first conductive layer is exposed from the first opening. The second membrane is disposed opposite to the first membrane. A second conductive layer and a second insulation layer are sequentially disposed on a surface of the second membrane facing the first membrane. The second insulation layer has a second opening, which is formed corresponding to the first opening, in the pressing area, so that a part of the second conductive layer is exposed from the second opening to face the first conductive layer in the first opening.