Electronic Keyboard Circuit Board Assembly and Thermal Management

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Solution Overview

Problem

The assembly of electronic keyboard instruments is cumbersome due to the need for separate screwing of the main circuit board, and the wiring is prone to heat damage from the heat radiating plate, leading to issues like melted coatings and uneven heat distribution.

Innovation Solution

The design features a lower case with a bottom plate and an upper case with an upper plate, where the circuit board is sandwiched between the two cases using slits, eliminating the need for screwing and positioning the heat radiating plate away from the keyboard to prevent heat trapping, with a heat blocking plate to protect wiring from heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the main circuit board is screwed to the back plate portion of the rear housing section, then the circuit board can be securely fixed, but the assembling work becomes extremely cumbersome

Engineering Contradiction:
Improvesecure fixation of circuit boardVSAvoidassembling work
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the circuit board attachment function with the housing structure itself. The back plate portion is designed with through-holes that directly receive and hold the circuit board, eliminating the need for separate screwing operations. This merging of attachment mechanism into the housing structure achieves secure fixation while greatly simplifying assembly.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing structure provides its own fixation mechanism through the back plate's through-holes, which inherently hold the circuit board in place without requiring additional fastening components or operations. The structure serves its own attachment function, reducing assembly complexity.

Inventive Principle:
Principle #25Self-service

2Ease of manufacture

If the wiring is positioned to pass across the heat radiating plate, then wiring can be routed simply, but heat causes unwanted melting of the coating and adverse influence on the wiring section

Engineering Contradiction:
Improvewiring routingVSAvoidheat damage to wiring
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the wiring from the harmful thermal environment by positioning it away from the heat radiating plate. The wiring is routed through designated pathways that maintain distance from the heat source, separating the wiring function from the heat radiation zone to prevent thermal damage while maintaining routing simplicity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces intermediate structures (such as the back plate portion and designated wiring pathways) that act as mediators between the heat radiating plate and the wiring. These intermediaries provide thermal isolation, allowing the wiring to be positioned conveniently while protecting it from direct heat exposure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If heat is dissipated toward the wiring section from the heat radiating plate, then heat can be removed from the circuit board, but it causes uneven heat distribution and potential damage to the wiring coating

Engineering Contradiction:
Improveheat dissipation from circuit boardVSAvoidheat distribution uniformity
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The patent applies local quality control by providing different thermal characteristics in different regions. The back plate portion has through-holes positioned to allow heat dissipation from the circuit board while maintaining areas of thermal protection for the wiring. This localized thermal management enables heat removal where needed while preventing overheating in sensitive areas.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS7709717B2Structure for electronic keyboard instrument
Publication Date: 2010.05.04 YAMAHA CORP
  • US7709717B2 patent drawing
  • US7709717B2 patent drawing
  • US7709717B2 patent drawing

AI summary

Structure for an electronic keyboard instrument includes upper and lower cases. The lower case has a bottom plate having lower slits, and the upper case has an upper plate having upper slits. The upper and lower cases are fastened together with the upper case overlapped on the lower case and with opposite edge portions of a circuit board inserted in the lower and upper slits in such a manner that the circuit board is disposed upright between the upper and lower cases. Heat radiating plate is attached to the circuit board. A wiring, drawn out from an operation section provided on the upper case, is wired to pass across a neighborhood of the upper end surface of the heat radiating plate under the lower surface of the upper plate. Heat blocking plate is provided between the heat radiating plate and the wiring to block transfer of heat from the heat radiating plate to the wiring.