Keyboard Keycap Airflow Structure for Thin Chassis Cooling
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Solution Overview
Problem
In electronic apparatuses like laptops, the demand for thinner chassis poses a challenge in securing space for large cooling modules, leading to heat transfer issues where the keyboard device on the upper surface becomes uncomfortably warm due to limited heat escape routes.
Innovation Solution
The design incorporates keycaps with side walls that hang down from the peripheral edge and form an air flow path by widening the clearance between the keycaps and the frame, creating a flow path formation part to enhance airflow and reduce temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the chassis is thinned to meet demand for thinner electronic apparatus, then the overall size and weight are reduced, but the space for installing a large-sized cooling module is insufficient, causing heat to transfer to the keyboard device
Solution Approach 1:
The side wall of the keycap is divided into multiple surfaces including a first side surface, second side surface, third side surface, and fourth side surface. The flow path formation part is created by modifying specific side surfaces (first, second, and/or fourth side surfaces) to have inclined planes or recessed portions, segmenting the heat flow path and creating multiple escape routes for heat away from the keyboard device
Solution Approach 2:
The invention creates a three-dimensional flow path formation part by adding inclined planes and recessed portions to the side wall surfaces of the keycap. This dimensional modification transforms the originally flat side wall into a complex 3D structure that actively guides heat flow in multiple directions, providing additional heat escape routes without increasing chassis thickness
2Stability of the object's composition
If each keycap is surrounded by a frame configuration, then the keycaps are isolated and structurally stable, but the number of escape routes for heat transferred from the chassis is limited, causing thermal problems
Solution Approach 1:
The frame configuration is maintained for structural stability, but local modifications are made to specific side surfaces of the keycap. The first, second, and/or fourth side surfaces are modified with inclined planes or recessed portions to create flow path formation parts, while other surfaces maintain the original frame configuration. This local quality change creates additional heat escape routes without compromising overall structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases the air suction amount of the fan devices, improving cooling performance and effectively suppressing temperature rise in the keyboard device by enhancing airflow and heat dissipation.
Implementation Method 1
a flow path formation part which widens a clearance between that side wall and the frame and thereby forms an air flow path is provided
Implementation Method 2
an inclined plane which gradually inclines in a direction of separating from the frame toward a lower end of that side wall is provided
Data Source
AI summary
An electronic apparatus includes a chassis, a keyboard device which is installed on the upper surface side of the chassis and has a plurality of keycaps and a frame which is installed on the upper surface side of the chassis and isolates the respective keycaps of the keyboard device from one another, in which each of at least some of the plurality of keycaps has an upper plate which forms an operation surface, and side walls on four sides which are provided so as to hang down from a peripheral edge part of the upper plate and face the frame respectively, and in at least the side wall on one side of the side walls on the four sides, a flow path formation part which widens a clearance between that side wall and the frame and thereby forms an air flow path is provided.