Keyboard LED Pad Layout for Stable Solder Coupling
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Solution Overview
Problem
Conventional light emitting devices face issues with unreliable electrical coupling and uneven distribution of conductive material during manufacturing, leading to potential rotation and displacement of light emitting units and circuit breakage.
Innovation Solution
A light emitting device with a symmetrical first conductive pad and symmetrical axis, coupled with spaced second conductive pads and conductive columns, ensures stable electrical connections and uniform distribution of solder material, enhancing product reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If molten conductive material is used to form the circuit, then the circuit can be formed on the substrate, but the light emitting units are prone to rotation and displacement leading to unreliable electrical coupling
Solution Approach 1:
The patent introduces a positioning structure that is pre-formed on the substrate before the molten conductive material is applied. This positioning structure includes positioning protrusions that fit into corresponding positioning recesses on the light emitting units, establishing their correct positions in advance before soldering occurs, thereby preventing rotation and displacement during the manufacturing process.
Solution Approach 2:
The patent introduces a positioning structure as an intermediary element between the substrate and the light emitting units. This positioning structure acts as a mediator that guides and constrains the light emitting units into their correct positions during the soldering process, ensuring reliable electrical coupling without compromising the ease of circuit formation.
2Ease of manufacture
If molten conductive material is used to form the circuit, then the circuit can be created, but the conductive material is susceptible to uneven distribution due to cohesive forces
Solution Approach 1:
The patent applies local quality by creating a positioning structure with specific local geometries (positioning protrusions and recesses) that locally constrain the molten conductive material. These localized structures guide the flow and distribution of the conductive material, ensuring uniform thickness and preventing aggregation or void formation in critical areas during the soldering process.
Solution Approach 2:
The positioning structure is prepared in advance on the substrate before the molten conductive material is applied. This preliminary action creates predetermined pathways and constraints that control the distribution of the conductive material, ensuring uniform thickness and preventing defects before the soldering process completes.
3Quantity of substance
If the conductive material is thinner in some areas, then the circuit can be formed with less material, but these areas are prone to breakage
Solution Approach 1:
The positioning structure creates localized regions with enhanced conductive material deposition. The positioning protrusions and recesses act as molds that concentrate and evenly distribute the molten conductive material, ensuring sufficient thickness and strength in critical connection areas while maintaining overall material efficiency.
Solution Approach 2:
The positioning structure provides beforehand cushioning by pre-establishing geometric constraints that prevent excessive thinning of the conductive material. The positioning recesses are designed to accommodate and evenly distribute the molten conductive material, ensuring minimum thickness requirements are met before solidification, thereby preventing future breakage.
Data Source
AI summary
A light emitting device and a keyboard structure are provided. The light emitting device includes a circuit board and multiple light emitting units. The circuit board includes a substrate, a first conductive pad, multiple second conductive pads, and multiple third conductive pads. The first conductive pad and the second conductive pads are disposed on a first board surface of the substrate. The first conductive pad has a symmetrical shape and a symmetrical axis. The symmetrical axis passes through the second conductive pads. The third conductive pads are disposed on a second board surface of the substrate. Each of the third conductive pads is electrically coupled to the first conductive pad and the second conductive pads by multiple conductive columns. Each of the light emitting units is connected to the first conductive pad and one of the second conductive pads.