Mechanical Keyboard Printed Membrane Structure for Dense Durable Traces
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Solution Overview
Problem
The manufacturing of printed circuit boards (PCBs) for computer peripheral devices is energy-intensive and wasteful, leading to significant sustainability issues, particularly in larger devices like keyboards that require complex circuitry connections, and existing printed membranes face challenges in robustness and trace density due to mechanical and electrical stress.
Innovation Solution
The use of printed membranes with a thin, flexible membrane layer and a mechanical support layer to form circuits, utilizing additive manufacturing techniques, and implementing customized tracing designs and low-temperature joining methods to ensure robust electrical connections and reduce material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional PCBs are used to carry circuits in computer peripheral devices, then reliable electrical connections can be achieved, but the manufacturing process becomes energy-intensive and produces large material waste
Solution Approach 1:
The patent changes the manufacturing approach from subtractive PCB fabrication to additive printed membrane circuitry. The membrane layer with printed traces is bonded to the PCB, allowing circuits to be formed by depositing conductive material in precise patterns rather than removing material to create copper traces. This additive approach reduces material waste while maintaining electrical connection reliability through direct printing of conductive paths.
Solution Approach 2:
The patent creates a composite structure combining a traditional PCB substrate with a printed membrane layer. The membrane layer contains printed conductive traces made from conductive ink or paste, which are bonded to the PCB surface. This composite approach allows the benefits of both traditional PCB structural reliability and printed circuit flexibility with reduced material consumption.
2Adaptability or versatility
If PCBs are used for larger peripheral devices like keyboards requiring circuitry to connect each key, then comprehensive electrical connectivity is achieved, but the carbon footprint increases significantly
Solution Approach 1:
The patent segments the circuitry into two parts: the main PCB contains only the essential controller and processing circuits, while the membrane layer contains the key matrix circuitry. This segmentation allows the high-material-use areas (key connections) to be printed with minimal material, reducing the overall carbon footprint while maintaining comprehensive electrical connectivity across all keys.
Solution Approach 2:
The patent extracts the key matrix circuitry from the traditional PCB structure and relocates it to a separate printed membrane layer. This extraction removes the need for extensive copper routing and soldering on the PCB itself, reducing manufacturing energy consumption and carbon footprint while preserving full key connectivity through the printed membrane circuit paths.
3Loss of substance
If printed membranes are used to reduce PCB dependency, then sustainability improves, but trace density and robustness under mechanical and electrical stress deteriorate
Solution Approach 1:
The patent uses a composite membrane structure with multiple layers including support layers, conductive trace layers, and protective insulation layers. The support layer provides mechanical strength to prevent trace damage, while the conductive layers provide electrical pathways. This composite construction maintains trace robustness under mechanical and electrical stress while keeping material usage low through precise printing techniques.
Solution Approach 2:
The patent employs a flexible membrane structure that can accommodate mechanical deformation without damaging the printed traces. The thin film construction allows the membrane to flex and return to its original position, maintaining electrical connectivity under mechanical stress. This flexible membrane approach reduces material usage compared to rigid PCB structures while improving trace durability through the membrane's inherent flexibility and stress distribution properties.
Data Source
AI summary
Embodiments of the present invention may encompass electronics assemblies of computer peripheral devices. The assemblies may include an outer top case. The assemblies may include a mechanical support layer disposed on an inner side of the outer top case. The assemblies may include a membrane layer coupled with the mechanical support layer. The membrane layer may include a printed trace on at least one surface of the membrane layer. The assemblies may include a ground plane positioned on an opposite side of the membrane layer as the outer top case such that the mechanical support layer and the membrane layer are disposed between the outer top case and the ground plane.