Keyed Heat Sink and Conductive Trim for Compact Lighting Modules

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Solution Overview

Problem

Conventional lighting modules with integrated light sources, drivers, and connectors are too large to fit into limited ceiling and wall spaces, particularly in multi-family housing and commercial settings, and suffer from inadequate heat dissipation due to confined installation areas.

Innovation Solution

A compact lighting module design featuring a heat sink with partitioned cavities, a driver enclosure, and a standardized connector, allowing for miniaturization and effective heat dissipation through a thermally conductive trim, while ensuring electrical insulation and easy installation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional lighting modules with integrated components are used, then electrical safety and component integration are improved, but the module size becomes too large to fit into limited ceiling and wall spaces

Engineering Contradiction:
Improveelectrical safetyVSAvoidmodule size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The lighting module is divided into functionally independent sections: a heat sink portion containing the light source, a driver enclosure portion containing the driver electronics, and a trim portion. These sections are coupled together but can be designed and manufactured separately, allowing optimization of each component's size and function while maintaining overall compactness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The driver enclosure is positioned within or adjacent to the heat sink structure, with the driver mounted on the heat sink's interior surface. The trim portion covers the exterior of both components, creating a nested arrangement where smaller components are housed within or alongside larger structural elements, maximizing space utilization.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Volume of moving object

If the lighting module is miniaturized to fit limited spaces, then installation flexibility is improved, but heat dissipation capability deteriorates

Engineering Contradiction:
Improvemodule sizeVSAvoidheat dissipation
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The light source is extracted from traditional bulb configurations and mounted directly on a dedicated heat sink structure. This separation allows the light-emitting component to be positioned optimally for both compactness and thermal management, with the heat sink serving as both a structural support and a thermal management system.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The heat sink is designed with varying thickness and surface area distribution: thicker sections near the light source to absorb concentrated heat, and thinner sections toward the periphery. The driver enclosure is positioned to utilize cooler regions of the heat sink, creating local thermal zones that optimize both compactness and heat dissipation.

Inventive Principle:
Principle #3Local quality

3Reliability

If a separate enclosure is required for electrical insulation, then safety is improved, but the overall device complexity and space requirements increase

Engineering Contradiction:
Improveelectrical insulationVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The driver enclosure serves dual functions: it houses the driver electronics and simultaneously provides electrical insulation between the low-voltage driver circuitry and the high-voltage power input. The heat sink structure also provides insulation between the light source and surrounding components. This merging of structural and insulating functions eliminates the need for separate insulating enclosures.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Each component performs multiple functions: the heat sink provides thermal management, structural support, and electrical insulation; the driver enclosure houses electronics, provides insulation, and serves as a mounting surface; the trim provides mechanical protection, aesthetic finish, and additional insulation. This multi-functionality reduces overall device complexity while maintaining safety.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enables installation in spaces as small as 2.4 inches wide and 2.25 inches high, with efficient heat dissipation and electrical safety, suitable for various lighting fixtures without requiring additional ground connections, facilitating easy installation and maintenance.

Implementation Method 1

efficient heat dissipation through a thermally conductive trim

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12546465B2Lighting module with keyed heat sink coupled to thermally conductive trim
Publication Date: 2026.02.10 DMF INC
  • US12546465B2 patent drawing
  • US12546465B2 patent drawing
  • US12546465B2 patent drawing

AI summary

A lighting module includes a heat sink having a sidewall and a partition that defines a first cavity and a second cavity; a driver enclosure disposed in the first cavity and electrically insulated from the heat sink; a driver disposed in the driver enclosure to provide electrical power; a light source disposed in the second cavity and receiving the electrical power; an optical element positioned over the light source; and a retaining ring/optic cover closing the second cavity. A trim is mechanically and electrically coupled to the heat sink of the lighting module and connected to an electrical ground via the heat sink. The lighting module fits into a space having a width less than 2.4 inches. The heat sink includes at least one curved keyed feature reducing the volume of the heat sink and providing sufficient clearance for the heat sink to fit within an enclosed space.