Kickstand Heat Dissipation Path for Compact Information Handling Systems
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Solution Overview
Problem
As portable information handling systems increase in processing power and reduce in size, the challenge of effectively dissipating heat becomes more critical, as existing heat dissipation methods may not adequately manage the higher thermal design power (TDP) within the compact chassis.
Innovation Solution
The integration of a flexible thermally conductive foil, such as graphite foil, coupled with a heat transfer device and a stand or kickstand, allows for efficient heat dissipation by transferring heat from the system components to the chassis, which can then dissipate it into the environment, utilizing materials like graphite and vapor chambers to spread and manage heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If portable information handling systems increase processing power, then computational capability is improved, but heat generation increases making effective heat dissipation difficult
Solution Approach 1:
The patent combines multiple heat dissipation mechanisms into a unified system: vapor chambers are integrated with heat pipes, which connect to graphite foils and chassis structures. This merged thermal management system efficiently handles the increased heat generation from higher processing power by distributing heat across multiple coupled components rather than relying on a single dissipation path.
Solution Approach 2:
The patent employs composite material structures including graphite foils combined with vapor chambers and heat pipes. These composite thermal management components leverage the high thermal conductivity of graphite alongside the phase-change and capillary action mechanisms of vapor chambers and heat pipes, creating a multi-mechanism heat dissipation solution that effectively manages thermal loads from increased processing power.
2Volume of moving object
If the size of portable information handling systems is reduced, then portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent implements a nested heat dissipation architecture where heat pipes are embedded within vapor chambers, and both are integrated with the chassis structure and stand components. This nested arrangement maximizes heat dissipation surface area and thermal conduction paths within the limited volume of the compact device, enabling effective heat management despite the reduced overall system size.
Solution Approach 2:
The patent utilizes the stand or kickstand structure as an additional heat dissipation dimension. By thermally coupling the stand to the internal heat generation components through graphite foils and heat pipes, the design extends the heat dissipation pathway from the traditional horizontal chassis surfaces to the vertical stand structure, effectively adding another dimension for heat rejection in the compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the ability to manage higher thermal loads by maintaining chassis temperatures below usability thresholds, even with increased processor power usage, ensuring effective heat management in compact portable systems.
Implementation Method 1
the at least one flexible thermally conductive foil may be configured to thermally transfer heat from the heat transfer device to the stand of the chassis
Implementation Method 2
a vapor chamber that includes a fluid
Implementation Method 3
The graphite beam may be configured to transfer heat from the at least one flexible thermally conductive foil to an environment surrounding the information handling system
Data Source
AI summary
In one or more embodiments, an information handling system may include: a chassis that houses the information handling system and that includes a stand configured to rotate away from and towards a portion of a rear side of the chassis; a heat transfer device (HTD) that includes a fluid; and at least one flexible thermally conductive foil (FTCF) thermally coupled to the HTD and thermally coupled the stand of the chassis. For example, the at least one FTCF may be configured to thermally transfer heat from the HTD to the stand of the chassis. In another example, the chassis may include at least one hinge that couples the stand to the chassis, in which the at least one hinge is configured to permit the stand rotate through an angle. For instance, the at least one hinge may permit the stand to be configured at different positions within the angle.