Kinematic Holding System for Placement Head Axis Error Compensation
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Solution Overview
Problem
Placement apparatuses in the semiconductor industry face challenges in achieving precise, plane-parallel component placement on substrates due to deformation-induced axis errors and tilting, which lead to reduced holding force, poor contact, and decreased throughput, especially with asymmetric placement head supports.
Innovation Solution
A kinematic holding system with a length-variable holding member that adjusts the pivoting position of the placement head relative to the support, using either passive elements like springs or active actuators to compensate for deformation-induced errors, allowing continuous alignment correction during the placement process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the placement head support is made as stiff as possible to avoid deformation-induced axis errors, then manufacturing precision is improved, but device complexity and mass increase
Solution Approach 1:
The patent applies the dynamics principle by making the placement head support movable rather than rigid. The support is designed to deform elastically under pressing forces, and this deformation is measured by sensors. The control system then actively compensates for the measured deformation by adjusting the placement head position in real-time, transforming a static rigid structure into a dynamic adaptive system that maintains precision without requiring excessive stiffness.
2Manufacturing precision
If the placement head support is made as stiff as possible to avoid deformation-induced axis errors, then manufacturing precision is improved, but productivity decreases due to increased mass
Solution Approach 1:
The patent applies the dynamics principle by making the placement head support movable rather than rigid. The support is designed to deform elastically under pressing forces, and this deformation is measured by sensors. The control system then actively compensates for the measured deformation by adjusting the placement head position in real-time, transforming a static rigid structure into a dynamic adaptive system that maintains precision without requiring excessive stiffness.
3Manufacturing precision
If a symmetrical arrangement of the placement head support is used to prevent tilting, then manufacturing precision is improved, but device complexity and design limitations increase
Solution Approach 1:
The patent applies the feedback principle by implementing a closed-loop control system. Sensors measure the actual deformation and tilting of the placement head support during operation, and this measurement feedback is fed to a control system that calculates and applies compensatory adjustments to the placement head position. This feedback mechanism enables the system to maintain precision with asymmetric, simpler support arrangements rather than requiring complex symmetrical designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise, plane-parallel placement with high placement force and increased throughput by minimizing mass and avoiding the need for excessively stiff structures, while maintaining the desired axial position of the placement head during deformation.
Implementation Method 1
at least one spring whose length changes depending on a deformation-induced displacement of the joint in such a way that a predetermined axial position of the placement head is maintained
Data Source
AI summary
A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated.