Kit-less Pick and Place Handler Thermal Soak Plate
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Solution Overview
Problem
Conventional IC test handlers are costly and inefficient due to the need for custom thermal soak plates and mechanical alignment for each type of IC, requiring frequent device repositioning and handling, which increases the time for thermal conditioning and alignment, limiting throughput.
Innovation Solution
A kit-less pick and place handler system that uses a thermal soak plate with a tacky surface for accurate device positioning, reducing the need for mechanical structures and allowing devices of different sizes to be tested on the same plate, along with a vision alignment strategy and pressurized helium for heat transfer, minimizing device handling and repositioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If custom thermal soak plates with mechanical alignment structures are used for each IC type, then manufacturing precision of device positioning is improved, but device complexity and cost increase
Solution Approach 1:
A single universal thermal soak plate with a tacky surface is used to handle multiple IC types and sizes, replacing the need for custom-designed soak plates for each IC type. The tacky surface provides sufficient positioning accuracy without requiring mechanical alignment structures, achieving multi-functionality while reducing complexity.
Solution Approach 2:
Mechanical alignment structures (pockets, slots, fixtures) are replaced with a tacky surface that provides positioning through adhesion rather than mechanical constraints. This substitution eliminates complex mechanical structures while maintaining positioning accuracy during thermal conditioning.
2Manufacturing precision
If individual mechanical alignment operations are performed for each IC, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The tacky surface on the thermal soak plate performs preliminary positioning of ICs before thermal conditioning begins. This preliminary action eliminates the need for repeated mechanical alignment operations during the testing process, maintaining accuracy while improving throughput by reducing intervention time.
Solution Approach 2:
The thermal soak plate with tacky surface performs self-alignment of ICs through adhesion forces, eliminating the need for external mechanical alignment operations. The plate automatically maintains IC position during thermal conditioning, reducing manual or automated intervention and increasing productivity.
3Manufacturing precision
If frequent device repositioning and handling are performed, then manufacturing precision is maintained, but loss of time increases
Solution Approach 1:
The tacky surface continuously maintains IC positioning throughout the entire thermal conditioning process without requiring intermittent repositioning or handling. This continuous action eliminates time losses associated with repeated placement and alignment operations, maintaining precision while reducing total time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves higher accuracy and increased throughput by maintaining device position and orientation with fewer corrections, reducing device damage and operational complexity, while allowing continuous testing without idle periods.
Implementation Method 1
The thermal soak plate can include a tacky surface for maintaining a position of the device based on a friction between the thermal soak plate and the device
Implementation Method 2
pressurized helium for heat transfer
Data Source
AI summary
The present disclosure provides for a kit-less pick and place handler which conducts thermal testing of at least one device. An exemplary handler includes a thermal soak plate, a first prime mover, a second prime mover, a test site actuator, and a test contactor. The thermal soak plate can receive devices and maintain an accurate position of the devices using a friction between the thermal soak plate and the device. The test contactor can electrically contact the device. The first prime mover can place the device on the thermal soak plate. The second prime mover can carry the device to the test contactor, hold the device during thermal testing, and move the device from the test contactor. The test site actuator can exert force on the second prime mover during thermal testing.