Process Kit Ring Adaptor for Automated Vacuum-Chuck Replacement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor processing, the deterioration of process kit rings leads to non-uniformity in processing, requiring frequent replacements that disrupt operations, contaminate systems, and result in significant downtime and resource wastage due to manual handling and requalification processes.
Innovation Solution
A process kit ring adaptor with a rigid carrier and vacuum interface structure allows for automated replacement of process kit rings using robotic arms and vacuum chucks, eliminating the need to open processing chambers and reducing requalification processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If process kit rings are manually replaced by opening processing chambers, then process kit ring replacement can be performed, but system contamination and downtime increase
Solution Approach 1:
The system is divided into separate functional modules: the process kit ring, the carrier that holds it, and the processing chamber. The carrier can be removed and replaced through the chamber opening without removing the chamber itself, allowing segmented replacement that minimizes contamination exposure.
Solution Approach 2:
The carrier acts as an intermediary between the process kit ring and the processing chamber. It provides a standardized interface that allows automated handling and replacement of the kit ring through robotic systems, eliminating direct manual intervention and reducing contamination risk.
2Ease of manufacture
If process kit rings are manually replaced, then replacement can be achieved, but downtime and operational disruption increase
Solution Approach 1:
Manual mechanical replacement operations are replaced with an automated robotic system. The end effector with gripper fingers automatically grasps, lifts, and replaces the carrier holding the process kit ring, transforming a manual task into an automated process that reduces downtime.
Solution Approach 2:
The process kit ring is pre-mounted on the carrier before insertion into the processing chamber. This preliminary assembly allows the complete unit to be quickly swapped as a single operation, rather than requiring in-chamber assembly during replacement.
3Manufacturing precision
If process kit rings are frequently replaced to maintain uniformity, then processing uniformity is maintained, but productivity and line yield decrease
Solution Approach 1:
The carrier design provides universal compatibility with standardized interfaces for both the process kit ring and the processing chamber. This universality allows rapid interchange of different kit rings while maintaining consistent positioning and processing uniformity, enabling frequent replacements without sacrificing productivity.
4Ease of manufacture
If manual replacement procedures are used, then process kit ring replacement can be performed, but operational complexity and resource consumption increase
Solution Approach 1:
The complex manual operations of opening chambers, manually handling kit rings, and performing requalification are extracted and replaced by a dedicated automated end effector system. This extraction consolidates multiple complex steps into a single automated replacement operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, automated replacement of process kit rings, minimizing downtime, maintaining processing uniformity, and reducing the impact on line yield, scheduling, and resource usage.
Implementation Method 1
The rigid carrier may further include a lower surface including a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck
Data Source
AI summary
A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.


