Knapsack with a cooling device
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Solution Overview
Problem
Existing cooling knapsacks do not provide an effective cooling solution, especially when carrying items that require low temperatures, resulting in an uncomfortable hot and sweaty back for the wearer.
Innovation Solution
A knapsack with a cooling device comprising a semiconductor chilling plate, radiating assembly, circulating pipe, tank, and circuit board, where the circuit board is connected to a power supply, and the radiating assembly includes a micro fan, micro liquid pump, and radiator, with a temperature sensor and control system to manage cooling, and the circulating pipe is arranged in an interlayer at the back of the knapsack to circulate cooling liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional airtight knapsack is used, then the knapsack structure is simple and airtight, but the back of the wearer becomes hot and sweaty due to poor heat dissipation
Solution Approach 1:
The patent introduces an intermediary cooling device consisting of a semiconductor chilling plate, circulating liquid system, and radiating assembly. This intermediary system acts as a mediator between the wearer's back and the external environment, actively removing heat through thermoelectric cooling and liquid circulation, thereby resolving the contradiction between maintaining simple structure and achieving effective temperature reduction.
Solution Approach 2:
The patent employs hydraulic principles by using a circulating liquid (water or other cooling fluids) pumped through tubes that contact the semiconductor chilling plate and radiating assembly. This liquid circulation system efficiently transports heat away from the knapsack back, providing active thermal management while managing the complexity through integrated pump and reservoir design.
2Temperature
If existing cooling knapsacks with air circulation are used, then the structure is simpler than active cooling systems, but the cooling effect is not obvious and cannot achieve freezing temperatures
Solution Approach 1:
The patent utilizes phase transition principles through the radiating assembly which includes components that facilitate heat dissipation through phase change mechanisms. The combination of semiconductor Peltier effect with radiating surfaces enables the system to achieve temperatures below ambient, potentially reaching freezing conditions, thereby resolving the limitation of insufficient cooling in existing designs.
Solution Approach 2:
The cooling device is segmented into distinct functional modules: semiconductor chilling plate, circulating liquid system with pump and reservoir, radiating assembly, and control circuitry. This segmentation allows each component to be optimized independently while working together to achieve superior cooling performance, managing complexity through modular design.
3Temperature
If a semiconductor chilling plate with radiating assembly and liquid circulation system is installed, then effective cooling and freezing capability is achieved, but the device complexity and weight increase
Solution Approach 1:
The patent employs thin-film and flexible component design in the radiating assembly and tubing system. By using thin-walled tubes for liquid circulation and compact radiating surfaces, the system achieves effective cooling with minimized material usage and weight, resolving the contradiction between cooling performance and portability.
4Temperature
If a semiconductor chilling plate with radiating assembly and liquid circulation system is installed, then effective cooling and freezing capability is achieved, but the device complexity and weight increase
Solution Approach 1:
The patent merges multiple cooling functions into an integrated system where the semiconductor chilling plate, liquid circulation system, and radiating assembly work as a unified thermal management solution. The control circuitry integrates power management, pumping control, and cooling activation into a single coordinated system, reducing operational complexity despite the advanced cooling capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The knapsack effectively reduces the temperature at the wearer's back by circulating cooled liquid through the interlayer, providing improved comfort and maintaining a cooler temperature.
Implementation Method 1
a semiconductor chilling plate, disposed at one side of the tank to cool the liquid in it
Implementation Method 2
a radiating assembly, disposed at one side of the semiconductor chilling plate to dissipate heat
Implementation Method 3
the micro liquid pump drives liquid to circulate in the tank and the circulating pipe
Implementation Method 4
the power supply drives said micro fan to rotate so as to cool the radiator
Data Source
AI summary
The present invention provides a knapsack with a cooling device. The knapsack comprises a knapsack body and a cooling device. The cooling device includes an electric motor, a radiating assembly and a circulating pipe. The electric motor is electronically connected with the radiating assembly. The radiating assembly is communicated with the circulating pipe. The circulating pipe consists of multiple curved U type units that connects with each other. The back of the knapsack body is provided with an interlayer. The multiple curved U type units of the circulating pipe are tiled in the interlayer. The cooling device is disposed in the knapsack to reduce the temperature of the back of the knapsack and keep it cool. It resolves the problem that the wearer's back feels hot and sweaty when the wearer uses the knapsack in hot day.