KoD Base Assembly With Conductive Pads for Short Push Travel

The patent combines the electrode pad and its support structure into a single integrated base assembly. The printed circuit board serves both as structural support and as the electrical connection medium, eliminating the need for separate mechanical components that previously connected electrodes to the touch sensor. This integration directly reduces mechanical complexity while maintaining reliable electrical connectivity.

The patent replaces traditional mechanical connection methods (such as separate mounting brackets, screws, or flexible cables) with a printed circuit board that provides both mechanical support and electrical connection in a unified planar structure. The FPC or PCB substitutes complex mechanical assembly with a streamlined electronic substrate that is both structurally sound and electrically functional.

The patent employs a dome switch mechanism that provides dynamic tactile feedback through controlled deformation. The dome structure allows for a short Z push travel distance while still delivering pronounced tactile feedback through the snap-action characteristic of the dome's elastic deformation. This enables enhanced user perception of push events without requiring excessive travel distance that would increase overall device height.

The patent optimizes the dome switch parameters (such as dome height, thickness, and material properties) to achieve maximum tactile feedback within a minimized Z push travel distance. By carefully selecting and tuning these parameters, the design delivers strong tactile sensation while maintaining a compact profile that ensures compatibility with various touch screen devices.

The patent segments the adhesive application into distinct functional zones on the base assembly. The adhesive is applied to specific regions (such as the peripheral rim or designated contact areas) rather than uniformly across the entire surface. This segmented approach creates effective sealing against foreign elements like water and dust while simplifying the manufacturing process by reducing the total adhesive quantity and application complexity.

The base assembly itself acts as a protective shell that, when combined with strategic adhesive placement, creates a sealed environment. The base assembly's structure works in conjunction with the adhesive to prevent foreign element ingress, eliminating the need for extensive adhesive coverage while maintaining water immunity and environmental protection.