L-Plated Lead IC Packaging for Stacking and Reliability
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in simplifying manufacturing processes, ease of stacking, reliability, reducing electrical components on circuit boards, and size reduction while maintaining functionality and performance, which are critical for competitive success in the electronics market.
Innovation Solution
The method involves creating an integrated circuit packaging system using a sacrificial support with cavities for plating L-plated leads, bonding a die to these leads, encapsulating them, attaching a carrier support, and then removing the sacrificial support to singulate individual packaging systems, which includes L-plated leads with both vertical and horizontal surfaces for improved connectivity and stacking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional packaging methods are used, then manufacturing processes are complex and time-consuming, but this approach fails to achieve simplified manufacturing and reduced time to market
Solution Approach 1:
The patent applies preliminary action by pre-plating the leads with the desired geometry (L-shaped configuration) before die attachment. This pre-preparation of conductive structures eliminates subsequent plating steps and simplifies the manufacturing process, directly addressing the contradiction between manufacturing simplicity and time to market
Solution Approach 2:
The patent segments the manufacturing process into distinct modules: sacrificial support with cavities for individual package preparation, carrier support for batch handling, and singulation step for separation. This segmentation enables parallel processing and simplifies each individual step, reducing overall manufacturing complexity and time
2Volume of moving object
If component size is reduced to decrease package size, then package dimensions are minimized, but this may compromise reliability and electrical connection quality
Solution Approach 1:
The patent transitions from traditional 2D planar connections to 3D vertical connections using L-shaped leads with both horizontal and vertical surfaces. This dimensional change allows compact package size while maintaining reliable electrical connections through multiple contact surfaces, resolving the contradiction between miniaturization and reliability
Solution Approach 2:
The patent employs composite plating structures on the leads (copper base with nickel and gold layers) to achieve both small size and high reliability. The multi-layer composite structure provides excellent electrical conductivity, corrosion resistance, and mechanical strength, enabling reliable connections in compact packages
3Adaptability or versatility
If more electrical components are added to circuit boards to increase functionality, then product features are enhanced, but this increases component count and board complexity
Solution Approach 1:
The patent merges multiple functions into the L-shaped lead structure: electrical connection, mechanical support, and stacking interface. This consolidation reduces the number of separate electrical components needed on the circuit board while maintaining enhanced functionality, directly addressing the contradiction between adaptability and device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances board-level reliability, simplifies manufacturing, reduces component count, and allows for smaller, more efficient packaging systems, addressing the need for increased functionality and reduced costs in a competitive market.
Implementation Method 1
plating an L-plated lead in the cavity
Data Source
AI summary
An integrated circuit packaging system and method of manufacture thereof includes: an L-plated lead; a die conductively connected to the L-plated lead; and an encapsulant encapsulating the L-plated lead and the die.