L-Shaped AiP Antenna Layout With Selective EMI Shielding
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Solution Overview
Problem
Conventional mmWave antenna modules experience significant signal loss due to epoxy-based molding compounds and electromagnetic interference (EMI) shields, which compromise shielding and reliability in high-frequency applications like 5G NR communications.
Innovation Solution
An L-shaped antenna-in-package (AiP) module design with an active circuit sub-module placed on an active side surface opposite the antennas, featuring a non-linear substrate and selective EMI shielding on the active module side to maintain reliability and performance while avoiding signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy-based molding compounds and EMI shields are used in conventional mmWave antenna modules, then shielding and reliability are improved, but signal loss increases significantly
Solution Approach 1:
The patent segments the antenna module into distinct functional zones: an active circuit sub-module placed on an active side surface, and antenna groups positioned on an antenna side surface. This spatial segmentation allows selective application of EMI shielding only where needed (near active circuits) while leaving antenna regions exposed for optimal signal transmission, thereby resolving the contradiction between shielding and signal loss.
Solution Approach 2:
The patent applies different material properties to different regions of the module. EMI shields are applied locally near the active circuit sub-module where electromagnetic interference is most problematic, while the antenna regions maintain different material characteristics that minimize signal loss. This local differentiation resolves the contradiction by providing shielding only where necessary without compromising overall signal transmission.
2Adaptability or versatility
If antennas are placed along the entire antenna side surface, then coverage is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the antenna array into multiple discrete groups positioned at specific locations along the antenna side surface rather than continuous coverage. This segmentation simplifies manufacturing by allowing modular assembly and testing of antenna groups, while still achieving comprehensive coverage through strategic placement of multiple groups across different directions.
Solution Approach 2:
The patent extends antenna coverage from a single plane to three-dimensional space by positioning multiple antenna groups at different locations and orientations. This dimensional approach achieves omnidirectional coverage without requiring continuous antenna elements, thereby simplifying manufacturing while maintaining versatility.
Data Source
AI summary
An antenna-in-package (AiP) module is described. The AiP module includes an antenna sub-module. The antenna sub-module is composed of a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface. The first package substrate is composed of a non-linear portion between the first group of antennas and the second group of antennas. The AiP module includes an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate. The active circuit includes a power management (PM) chip and a radio frequency (RF) chip coupled to a second package substrate coupled to the first package substrate.