L-Shaped Stacked FET Contacts for Lower Gate Capacitance

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Solution Overview

Problem

Current monolithic stacked field effect transistor (SFET) fabrication is challenging due to issues such as providing a wider separation between top and bottom FETs, reducing direct facing gate-to-contact capacitance, and ensuring adequate contact interface, particularly when using single self-aligned contact (SAC) caps.

Innovation Solution

The development of an L-shaped stacked field effect transistor (SFET) with separate top and bottom SAC caps, where the top and bottom SAC caps are formed at different elevations, allowing for a relatively wider contact interface, reducing direct facing capacitance by leveraging separate top and bottom SAC caps, and forming a bottom SAC caps, which frees the bottom SAC cap from top SAC cap requirements, allowing for a relatively wider bottom contacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a single self-aligned contact (SAC) cap is used in monolithic stacked FET fabrication, then the fabrication process is simplified, but the contact interface width is limited and direct facing gate-to-contact capacitance increases

Engineering Contradiction:
Improvefabrication process simplicityVSAvoidcontact interface width
Core Design Contradiction:
Ease of manufactureVSArea of moving object

Solution Approach 1:

The patent divides the single SAC cap structure into separate top and bottom SAC caps at different elevations. This segmentation allows each cap to be independently optimized for its respective contact interface, enabling wider contact interfaces without complicating the overall fabrication process excessively.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a vertical dimension differentiation by placing top and bottom SAC caps at different elevations. This dimensional change allows the bottom SAC cap to be positioned lower to achieve a wider contact interface while the top SAC cap remains at a higher elevation, effectively resolving the capacitance and width trade-off.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If top and bottom FETs are closely stacked to increase device density, then device footprint is reduced, but direct facing gate-to-contact capacitance increases

Engineering Contradiction:
Improvedevice densityVSAvoiddirect facing gate-to-contact capacitance
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

By utilizing different elevations for top and bottom SAC caps, the patent creates vertical separation between the gate structures and contact regions. This dimensional approach allows closely stacked FETs to maintain high density while reducing direct facing capacitance through the elevation difference between caps.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The separate top and bottom SAC caps act as intermediary structures that mediate between the closely stacked gate regions. These caps provide isolated contact interfaces that reduce direct capacitive coupling between adjacent FET gates while maintaining the high-density stacked configuration.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If the bottom SAC cap is constrained by top SAC cap requirements, then fabrication alignment is simplified, but the bottom contact interface width is limited

Engineering Contradiction:
Improvefabrication alignmentVSAvoidbottom contact interface width
Core Design Contradiction:
Manufacturing precisionVSArea of moving object

Solution Approach 1:

By segmenting the SAC cap structure into independent top and bottom caps, the patent allows each cap to be independently sized and positioned. The bottom SAC cap can be made wider to achieve a larger contact interface without being constrained by the dimensions of the top SAC cap, while still maintaining fabrication alignment through the self-aligned process.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20260006843A1L-shaped stacked field effect transistor
Publication Date: 2026.01.01 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US20260006843A1 patent drawing
  • US20260006843A1 patent drawing
  • US20260006843A1 patent drawing

AI summary

Embodiments of the present disclosure are directed to L-shaped stacked field effect transistor (SFET) processing methods and resulting structures having separate top and bottom self-aligned contact (SAC) caps. In a non-limiting embodiment, a first nanosheet stack having a first nanosheet and a second nanosheet stack having a second nanosheet are vertically stacked. A gate is formed around a channel region of the first nanosheet and a channel region of the second nanosheet. The gate includes a first portion recessed to a first gate height and a second portion recessed to a second gate height less than the first gate height. A bottom self-aligned contact cap is formed on the second portion of the gate and a top self-aligned contact cap is formed on the first portion of the gate.