L-Shaped Heat Conductive Component for Chip Package Thermal Management
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Solution Overview
Problem
Conventional chip package structures experience poor heat dissipation due to multiple layers between the heat sink and the chip, which hinders the efficient transfer of waste heat.
Innovation Solution
A chip package structure featuring a heat conductive component with an L-shaped design, where the horizontal portion is embedded in the redistribution structure and the vertical portion extends beyond the top surface, allowing direct contact between the chip and the heat sink for improved heat dissipation, along with a method involving ultrasonic welding for attaching the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers (encapsulation layers or adhesive materials) are disposed between the heat sink and the chip, then the chip can be electrically connected and adhered to the substrate, but the heat dissipation performance deteriorates due to poor heat transfer through the layers
Solution Approach 1:
The patent introduces a heat conductive component as an intermediary element between the chip and the heat sink. This component includes a first portion that contacts the chip and a second portion that extends to contact the heat sink, thereby mediating the heat transfer process. The intermediary structure provides both mechanical support and thermal conduction pathways, resolving the contradiction between maintaining electrical connection/adhesion and achieving effective heat dissipation.
Solution Approach 2:
The heat conductive component extends in the vertical dimension from the chip surface through the encapsulation layers to reach the heat sink. By adding this vertical extension, the patent creates a direct thermal conduction pathway that bypasses the thermal resistance of the horizontal encapsulation layers, thus improving heat dissipation while maintaining the layered structure for electrical connection.
2Device complexity
If several layers are placed between the heat sink and the chip, then the package structure can provide electrical connection and mechanical support, but the thermal resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The heat conductive component is made of a material with high thermal conductivity, forming a composite thermal management system. This composite structure combines the electrical insulation properties of the encapsulation layers with the high thermal conductivity of the heat conductive component, allowing the package to maintain both electrical connection and low thermal resistance simultaneously.
3Temperature
If the heat sink is directly attached to the chip, then heat dissipation is maximized, but electrical connection and mechanical adhesion cannot be established
Solution Approach 1:
The heat conductive component is segmented into at least two portions: a first portion that contacts the chip and provides electrical connection, and a second portion that extends to contact the heat sink for thermal management. This segmentation allows each portion to fulfill its specific function while working together as an integrated thermal management system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation by reducing thermal resistance and ensuring close contact between the heat sink and the chip, effectively managing waste heat accumulation.
Implementation Method 1
the heat conductive component is disposed over the circuit structure and has a horizontal portion and a vertical portion... the bottom of the chip contacts the second part of the horizontal portion of the heat conductive component... the heat sink contacts a top of the chip and a top of the vertical portion of heat conductive component
Implementation Method 2
the heat sink is attached to the top of the chip and the top of the vertical portion of the heat conductive component by ultrasonic welding
Data Source
AI summary
A chip package structure includes a circuit structure, a redistribution structure, a heat conductive component, a chip, and a heat sink. The circuit structure includes a first circuit layer. The redistribution structure is disposed on the circuit structure and includes a second circuit layer, wherein the redistribution structure has an opening. The heat conductive component is disposed on the circuit structure and covered by the redistribution structure. The heat conductive component has a horizontal portion and a vertical portion. The horizontal portion extends toward the opening until it exceeds the opening. The vertical portion extends upward beyond the top surface of the redistribution structure from a part of the horizontal portion. The chip is disposed in the opening, and the bottom of the chip contacts the heat conductive component. The heat sink is disposed over the redistribution structure and the chip.