L-Shaped Interconnect Members for Shock-Resistant Electrical Packages
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Solution Overview
Problem
As circuit devices, such as radio frequency modules, are miniaturized and mounted on smaller circuit boards, mechanical shock tests reveal increased failure rates due to stress on connections, particularly at the edges and corners where larger pads are required to accommodate smaller interconnect members.
Innovation Solution
The use of L-shaped and larger interconnect members, which occupy multiple grid cells and are positioned at corners or edges, provides improved mechanical reliability and thermal properties, allowing for increased mechanical strength and heat dissipation, while maintaining compatibility with smaller pads on the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of pads on circuit boards is decreased to reduce electronic device size, then the overall device size is reduced, but the mechanical strength of connections during shock tests deteriorates
Solution Approach 1:
The patent applies local quality by using L-shaped interconnect members specifically at corner positions where mechanical stress is highest during shock tests, while other positions use traditional circular interconnect members. This localized enhancement of connection strength at critical positions allows the overall device size to be reduced while maintaining connection reliability under mechanical shock conditions.
2Ease of manufacture
If traditional circular interconnect members are used on smaller pads, then manufacturing is simpler, but mechanical reliability during shock tests deteriorates
Solution Approach 1:
The patent implements local quality by differentiating interconnect member geometry based on position: L-shaped members at corners provide enhanced mechanical reliability where stress concentration occurs, while circular members at other positions maintain manufacturing simplicity. This selective approach improves overall reliability without significantly complicating the manufacturing process.
3Reliability
If L-shaped interconnect members are used at corners, then mechanical reliability during shock tests is improved, but the interconnect member geometry becomes more complex
Solution Approach 1:
The patent applies local quality by using L-shaped interconnect members only at corner positions where mechanical stress is highest during shock tests, while other positions use traditional circular interconnect members. This localized enhancement of connection strength at critical positions allows the overall device size to be reduced while maintaining connection reliability under mechanical shock conditions.
Solution Approach 2:
The patent uses partial action by implementing the complex L-shaped interconnect member geometry only where necessary (at corner positions experiencing highest stress) rather than throughout the entire array. This selective application provides the mechanical reliability benefits where needed while minimizing the overall complexity increase.
Data Source
AI summary
An electrical package can include a substrate having a first side and a second side opposite the first side. One or more electrical components mounted to the substrate, and a plurality of electrically conductive interconnect members can be coupled to the second side of the substrate. At least one of the interconnect members can be L-shaped. The L-shaped interconnect member with can be positioned at or proximate one of the corners. The interconnect members can be arranged as a two-dimensional array, with first interconnect members each occupying a single array location, and second interconnect members each occupying at least three array locations that are arranged nonlinearly. The package can be a dual-sided molded package.