L-Shaped Leadfinger IC Package for Thin High-Density Footprint
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Solution Overview
Problem
The need for integrated circuit packages that are smaller, thinner, and more reliable to meet the demands of miniaturization and increased functionality in portable devices, while also reducing costs and improving performance, has not been adequately addressed by existing technologies.
Innovation Solution
The development of an integrated circuit package system featuring L-shaped leadfingers adjacent to a single edge of the die, connecting die pads and encapsulating them with an epoxy mold compound to form a thin, high-density package configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional semiconductor package structures are used, then the package can provide basic electrical connection and protection, but the package size and thickness cannot be sufficiently reduced to meet miniaturization requirements
Solution Approach 1:
The patent transitions from conventional planar leadframe layouts to a three-dimensional L-shaped leadfinger configuration. The L-shaped leadfingers extend vertically and horizontally to connect die pads to external leads, enabling compact routing of electrical connections in limited space while reducing overall package thickness. This dimensional reorganization allows the package to achieve thinner profile without compromising connection reliability.
Solution Approach 2:
The patent implements a nested structure where the L-shaped leadfingers are integrated within the molding compound, and multiple leadfingers are arranged in a compact configuration. The leadfingers are embedded within the package structure, with internal connections nested within external connections, maximizing space utilization and enabling miniaturization while maintaining structural integrity and electrical reliability.
2Adaptability or versatility
If the number of devices used to fabricate IC products is reduced, then manufacturing cost decreases, but achieving higher functionality in smaller space becomes more difficult
Solution Approach 1:
The patent combines multiple functions into the L-shaped leadfinger structure. The leadfingers simultaneously serve as electrical interconnects, mechanical support elements, and space-efficient routing pathways. By merging these functions into a single integrated structure rather than using separate components, the package achieves higher functionality density within reduced area while maintaining ease of manufacturing.
Solution Approach 2:
The L-shaped configuration utilizes vertical and horizontal dimensions efficiently to route multiple electrical connections within a compact footprint. This multi-dimensional arrangement allows more I/O connections to be accommodated in smaller planar area compared to conventional linear leadframe layouts, thereby increasing functionality density without proportionally increasing package area.
3Ease of manufacture
If die pads are located only adjacent to a single edge of the die, then the package can be simplified and manufactured with fewer processes, but the electrical connection complexity increases
Solution Approach 1:
The patent segments the electrical connection path into distinct L-shaped leadfinger units, each responsible for connecting specific die pads to external leads. This segmentation allows the manufacturing process to handle connections in modular fashion, simplifying the overall manufacturing process. The L-shaped geometry of each segment efficiently routes connections from the single-edge die pad location to various external lead positions, managing connection complexity through structured segmentation.
Solution Approach 2:
The L-shaped leadfingers act as intermediary elements between the die pads located at a single edge and the external leads distributed around the package perimeter. These leadfingers provide the necessary electrical pathways and mechanical connections, simplifying the manufacturing process by establishing clear intermediate connection points while managing the complexity of electrical routing through their geometric configuration.
Data Source
AI summary
An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first L-shaped leadfingers adjacent the single edge, connecting the die pads and the first L-shaped leadfingers, and encapsulating the die pads and portions of the first L-shaped leadfingers to form a first package.