LAAC Module Interface for Pump and Leak Signal Integration
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Solution Overview
Problem
Previous information handling systems with liquid assisted air cooling (LAAC) modules and leak sensors required separate components and extensive PCB real-estate, leading to complex cable management and dual pin-outs on the motherboard, increasing complexity and space requirements.
Innovation Solution
Integration of the LAAC module and leak sensor into a single module that communicates via a single connector interface with the motherboard, utilizing a processor to monitor the coolant pump and leak sensor signals, providing tachometer signals to indicate pump operation and leak detection, thereby simplifying the interface and reducing component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate LAAC module and leak sensor components are used, then monitoring capability is improved, but device complexity and PCB real-estate requirements increase
Solution Approach 1:
The patent combines the LAAC module and leak sensor into a single integrated module that connects to the motherboard via a single connector interface. This merging eliminates the need for separate components and extensive cable management while maintaining both cooling functionality and leak detection capability through shared hardware resources and unified communication protocols.
2Reliability
If separate connector interfaces are used for LAAC module and leak sensor, then signal integrity is improved, but ease of operation and installation deteriorate
Solution Approach 1:
The integrated module employs a universal connector interface that handles multiple functions simultaneously - both LAAC communication and leak sensor signals are transmitted through the same connector pins. The motherboard processor distinguishes between different signal types through protocol interpretation, eliminating the need for separate dedicated connectors while maintaining signal integrity through proper electrical isolation and communication protocols.
3Measurement precision
If dual pin-outs are implemented on motherboard, then monitoring precision is improved, but manufacturing precision and assembly complexity increase
Solution Approach 1:
The patent merges multiple monitoring functions into a single connector interface with standardized pin assignments. The connector design incorporates dedicated pins for tachometer signals, leak detection, and control communications within a unified structure, reducing the need for multiple separate connector alignments while maintaining precise signal routing through careful internal trace design and shielding.
Data Source
AI summary
An information handling system includes a motherboard including a connector interface, and a liquid assisted air cooling (LAAC) module. The LAAC module includes a coolant pump to circulate coolant to one or more components in the information handling system, a leak sensor to detect whether the coolant is leaking, and a processor. The processor detects whether the coolant pump is operating properly. In response to the coolant pump not operating properly, the processor provides a first tachometer signal on a particular pin of the connector interface of the motherboard. The processor further monitors a voltage level received from the leak sensor. A first voltage level indicates a leak being detected, and a second voltage level indicates no leak being detected. In response to the voltage level being the first voltage level, the processor provides a second tachometer signal on the particular pin of the connector interface of the motherboard.