Label Support Structure With Expandable Filler for Planar Module Labeling
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Solution Overview
Problem
The miniaturization of semiconductor components in module assemblies, such as SSDs and memory modules, creates uneven surfaces that complicate label adherence and readability, leading to issues with automated optical inspections and increased manufacturing complexity.
Innovation Solution
A label support structure formed from expandable filler materials like graphene aerogel or ceramic foam, which conforms to the uneven topography and provides a planar surface for label adhesion, incorporating features like thermal conductivity and EMI shielding, and includes a removable interface for easy label replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor components are miniaturized to reduce module size, then the overall device dimensions are reduced, but the surface becomes uneven making label adherence difficult
Solution Approach 1:
A label support structure is introduced as an intermediary component between the uneven semiconductor components and the label. This support structure includes a filler material that conforms to the uneven topography while providing a substantially planar upper surface for label adhesion, effectively mediating the contradiction between miniaturization and surface uniformity.
Solution Approach 2:
The filler material in the label support structure is described as porous, allowing it to conform to the uneven surfaces of miniaturized semiconductor components while maintaining structural integrity. The porous nature enables the material to adapt to varying component heights and shapes, providing a planar labeling surface without requiring additional mechanical planarization steps.
2Shape
If a label support structure is added to provide a planar labeling surface, then label adherence is improved, but manufacturing complexity increases
Solution Approach 1:
The label support structure merges multiple functions into a single component: it provides mechanical support for the label, fills uneven spaces between components, and can incorporate thermal management and EMI shielding properties through the filler material. This consolidation reduces the need for separate structures for each function, thereby reducing overall manufacturing complexity.
Solution Approach 2:
The filler material is designed to serve multiple purposes simultaneously: structural support, thermal conduction, EMI shielding, and surface planarization. This multi-functionality eliminates the need for separate components for each function, simplifying the manufacturing process while achieving the desired labeling surface planarity.
3Ease of manufacture
If traditional filling materials are used, then manufacturing is simple, but thermal and electrical performance deteriorates
Solution Approach 1:
The filler material is formulated as a composite with specific properties including high thermal conductivity and EMI shielding capabilities. This composite material maintains ease of manufacture through standard dispensing and curing processes while simultaneously improving thermal and electrical performance compared to traditional filling materials.
Solution Approach 2:
The filler material's physical and chemical parameters are optimized to achieve both ease of manufacture and superior thermal/electrical performance. The material can be dispensed in a liquid or paste state for easy application, then cured to achieve the desired thermal conductivity and electrical properties, effectively changing parameters from processing state to final state.
4Ease of manufacture
If labels are affixed directly to uneven surfaces, then manufacturing is straightforward, but automated optical inspection fails
Solution Approach 1:
The label support structure acts as an intermediary that provides a substantially planar upper surface for label adhesion. This planar surface ensures proper label flatness and readability, enabling successful automated optical inspection while maintaining straightforward label application processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures label flatness and readability while reducing manufacturing costs and complexity by maintaining thermal and electrical performance, allowing for efficient label updates without altering component layouts.
Implementation Method 1
a label support structure formed from expandable filler materials like graphene aerogel or ceramic foam, which conforms to the uneven topography and provides a planar surface for label adhesion
Implementation Method 2
incorporating features like thermal conductivity and EMI shielding
Implementation Method 3
incorporating features like thermal conductivity and EMI shielding
Data Source
AI summary
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly includes a substrate populated with one or more semiconductor packages and a label support structure that includes an expandable filler material over the substrate.