Ladder Polysilsesquioxane Adhesive for High-Density PCBs
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Solution Overview
Problem
The semi-additive method for producing high-density printed circuit boards faces challenges with insufficient adhesion between the conductor circuit and the insulating substrate, especially when the substrate has a flat surface, which hinders the formation of high-density, fine circuit patterns.
Innovation Solution
A polyorganosiloxane compound with a specific ladder structure is synthesized through polycondensation of alkoxysilane compounds, providing excellent adhesion to metals, synthetic resins, and other materials, even on flat surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the surface of the insulating substrate is roughened to increase adhesion, then adhesion between the conductor circuit and substrate is improved, but it becomes difficult to form high-density, fine circuit patterns
Solution Approach 1:
The invention changes the chemical parameter of the substrate surface by introducing silane coupling agents that react with the substrate to form chemical bonds, rather than relying on physical roughness. This allows adhesion improvement through chemical bonding while maintaining surface flatness for fine circuit patterning.
Solution Approach 2:
The invention introduces silane coupling agents as intermediary substances between the substrate and conductor circuit. These agents form chemical bridges that enhance adhesion without requiring surface roughening, thus enabling both strong bonding and precise circuit formation.
2Manufacturing precision
If a copper foil layer is formed by electroless plating, then the circuit pattern can be accurately formed, but adhesion to the insulating substrate is insufficient on flat surfaces
Solution Approach 1:
The silane coupling agent acts as an intermediary layer between the insulating substrate and the electroless copper plating. It provides chemical bonding sites that enhance adhesion while allowing the copper layer to maintain its precise circuit pattern formation capability.
Solution Approach 2:
The invention creates a composite structure consisting of the insulating substrate, silane coupling agent layer, and electroless copper plating. This composite approach combines the advantages of chemical bonding from the silane layer with the precise patterning capability of electroless plating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive ensures strong bonding of glass, ceramics, metals, and synthetic resins, enhancing the adhesion of conductor circuits to insulating substrates and enabling the formation of high-density circuit patterns without surface roughening.
Implementation Method 1
a polyorganosiloxane compound having a ladder structure including a repeating unit shown by the following formula (I) in the molecule
Implementation Method 2
a cured product of this polyorganosiloxane compound firmly bonds a metal, a synthetic resin, and the like
Data Source
AI summary
Disclosed is an adhesive characterized by containing a ladder polysilsesquioxane having a repeating unit represented by formula (I) in a molecule. The adhesive contains a specific ladder polysilsesquioxane, and exhibits good adhesion to metals or synthetic resins. (In the formula, A represents a single bond or a linking group; R1 represents a hydrogen atom or the like; X0 represents a halogen atom, a group represented by the following formula: OG (wherein G represents a protecting group of a hydroxy group) or a cyano group; R2 represents an optionally substituted phenyl group, a C1-20 alkyl group which may have a substituent (excluding a halogen atom, a group represented by the formula: OG and a cyano group) or the like; and l, m and n each represents 0 or a natural number, provided that l and n are not 0 at the same time.)