Lamella Pack Bonding Using UV Pre-Activated Adhesive
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Solution Overview
Problem
The use of infrared radiation to activate adhesives for bonding lamellae in laminated cores results in unwanted deformation and electrical interference, necessitating complex cooling systems to mitigate these issues.
Innovation Solution
Employing an adhesive pre-activated with radiation in a wavelength range below infrared, such as cationically curing epoxy resin, to ensure reliable bonding without generating heat, thus eliminating the need for cooling and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If infrared radiation is used to activate the adhesive, then the adhesive bonding reliability is improved, but the lamella deformation increases due to heat generation
Solution Approach 1:
The patent changes the wavelength parameter of the activating radiation from infrared range to visible or UV range (below infrared). This parameter change allows the adhesive to be activated without generating heat, thus resolving the contradiction between bonding reliability and temperature control. The adhesive formulation is specifically designed to respond to this different wavelength range.
2Reliability
If infrared radiation is used to activate the adhesive, then the adhesive bonding reliability is improved, but the equipment complexity increases due to cooling devices
Solution Approach 1:
The patent extracts and eliminates the cooling system from the equipment by changing the radiation wavelength. Since the adhesive can be activated with visible or UV radiation without generating heat, the cooling devices are no longer needed, thus reducing equipment complexity while maintaining bonding reliability.
3Strength
If the adhesive reaction time is extended to ensure proper bonding, then the bonding strength is improved, but the productivity decreases due to longer processing time
Solution Approach 1:
The patent applies preliminary action by pre-activating the adhesive with visible or UV radiation immediately upon application, before the lamella is placed. This pre-activation creates an initial bond strength that allows immediate handling and stacking, eliminating the need for extended reaction times and thereby maintaining high productivity while ensuring sufficient bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves sufficient strength for immediate handling and shipping of lamella packs without deformation, maintaining electrical integrity and reducing equipment complexity.
Implementation Method 1
an adhesive is used that can be pre-activated with radiation in a wavelength range below that of infrared radiation
Data Source
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AI summary
The process is used to produce lamella packs (3) from superimposed lamellae (2) that are separated from a starting material (1) and bonded together within the lamella pack (3) by means of a radiation-activated adhesive (4). The adhesive (4) is irradiated with radiation in a wavelength range below infrared radiation for pre-activation. The system used for this purpose has at least one application device for applying the adhesive (4) to a lamella (2). The adhesive (4) is irradiated with at least one radiation source (32) that emits radiation in a wavelength range below the infrared range.