Laminar Bus Plate Capacitor Assembly for Resonance and Heat Control
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Solution Overview
Problem
Conventional capacitor assemblies face challenges with bus resonances, high capacitance, high frequencies, large physical volume, and high ripple currents, leading to thermal management issues and premature failure, especially in applications requiring high power and AC current.
Innovation Solution
A laminar bus plate arrangement with wound film capacitor elements connected via elongate conductors, thermal shields, and cooling plates to mitigate bus resonances and enhance thermal management, featuring a multilayer structure with insulated bus plates and orthogonal mounting of capacitor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional bus structures are used to connect capacitor elements, then the assembly can handle high power and AC current, but bus resonances are exacerbated and thermal management becomes difficult
Solution Approach 1:
The bus structure is segmented into multiple laminar bus plates arranged in layers, with capacitor elements distributed between them. This segmentation reduces the inductance of each bus segment and minimizes bus resonances while maintaining high power handling capability.
Solution Approach 2:
The invention transitions from a conventional planar bus structure to a three-dimensional laminar arrangement where bus plates are stacked in multiple layers. This dimensional change reduces the current path length and inductance, effectively mitigating bus resonances at high frequencies.
2Reliability
If capacitor elements are arranged to present sequential impedance range, then impedance behavior is optimized, but thermal management of high ripple currents becomes problematic
Solution Approach 1:
Multiple bus plates are merged into a unified laminar structure with interconnected conductive paths. This merging creates redundant current paths that distribute ripple currents across multiple plates, reducing thermal hotspots while maintaining optimized impedance behavior.
Solution Approach 2:
Insulating layers are introduced as intermediaries between adjacent bus plates of the same polarity, while conductive paths provide thermal coupling. This intermediary structure enables thermal management by facilitating heat dissipation while maintaining electrical isolation.
3Power
If multiple pairs of terminals are used to meet high current requirements, then current density uniformity is achieved, but device complexity increases
Solution Approach 1:
Each bus plate serves multiple functions: it provides electrical connection for current distribution, structural support for mounting capacitor elements, and thermal management pathway. This multi-functionality reduces the need for separate terminal structures while maintaining current density uniformity.
Solution Approach 2:
The laminar bus plate structure provides homogeneous current distribution across all plates through symmetrical arrangement and identical connection patterns. This homogeneity ensures uniform current density across multiple terminals without requiring complex asymmetric terminal configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces inductance and ripple currents, improves thermal conductivity, and maintains smooth impedance behavior, effectively managing heat and preventing premature failure in large capacitor assemblies.
Implementation Method 1
an elongate conductor extending along an axis of each of the capacitor elements, the elongate conductor providing electrical communication between the second polarity terminal of the respective capacitor element and the second polarity bus plate
Implementation Method 2
a first cooling plate in thermally conductive relationship with but orthogonal to the second polarity bus plate
Data Source
AI summary
A capacitor assembly includes a laminar bus plate arrangement having at least one first polarity bus plate and at least one second polarity bus plate separated by a sheet-like insulator. At least one pair of bus terminals have a first polarity bus terminal electrically connected to the first polarity bus plate and a second polarity bus terminal electrically connected to the second polarity bus plate. A plurality of wound film capacitor elements each have a first end surface and a second end surface defining a proximal first polarity terminal and a distal second polarity terminal, respectively. An elongate conductor extends along an axis of the respective capacitor elements, the elongate conductor providing electrical communication between the second polarity terminal of the respective capacitor element and the second polarity bus plate. The first polarity terminal of each of the capacitor elements is electrically connected to the first polarity bus plate.