Laminar flow device
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Solution Overview
Problem
In high-precision semiconductor processes, wafers are exposed to pollutants like ammonia, chlorine, and particulates when removed from sealed carriers, leading to surface defects and yield reduction due to the lack of protection against external contaminants.
Innovation Solution
A laminar flow device with a housing, air inlet, diffusion device, and uniform flow structure generates a uniform airflow by converting dynamic pressure into static pressure, using a diffusion frame and connecting space to output gas as a clean, pollutant-free airflow, effectively preventing contamination of wafers during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a wafer is taken out from a sealed carrier for processing, then the wafer can be processed, but pollutants will enter the sealed carrier and contaminate the wafer surface
Solution Approach 1:
A laminar flow device is introduced as an intermediary between the external environment and the sealed carrier. The device generates a uniform laminar airflow that creates a protective flow field around the wafer opening, preventing pollutants from entering the carrier while allowing the wafer to be accessed for processing.
Solution Approach 2:
The patent creates a controlled airflow environment using clean, filtered air that acts as an inert protective atmosphere. This laminar flow of clean air surrounds the wafer opening area, displacing potential pollutants and maintaining a contamination-free zone during the wafer handling process.
2Ease of operation
If the sealed carrier is opened to access the wafer, then the wafer can be processed, but the protection against pollutants is lost
Solution Approach 1:
The laminar flow device is activated and establishes a protective airflow field before the sealed carrier is opened. This preliminary action ensures that when the carrier opening occurs, the wafer is already surrounded by a controlled clean environment, maintaining protection while enabling access.
Solution Approach 2:
The laminar flow device serves as a mediator between the opened carrier and the external environment. It allows the carrier to be open for wafer access while simultaneously blocking pollutant entry through the controlled airflow barrier.
3Reliability
If traditional sealed carriers are used, then wafer storage is protected, but pollutant ingress occurs during opening operations
Solution Approach 1:
The laminar flow device acts as an intermediary protective system that extends the protection beyond the sealed carrier walls. During opening operations, the device generates a localized clean environment that compensates for the temporary loss of seal protection, preventing pollutant ingress while allowing carrier opening.
Solution Approach 2:
The patent changes the environmental parameters around the carrier opening by introducing a controlled laminar airflow with specific velocity and direction characteristics. This creates a dynamic protective zone that maintains positive pressure and flow patterns preventing pollutant entry during the opening process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminar flow device ensures a clean and uniform airflow, preventing pollutant ingress and reducing wafer surface defects, thereby enhancing the yield and integrity of semiconductor processing by maintaining a pollution-free environment.
Implementation Method 1
at least one diffusion device positioned within the housing... the diffusion device further comprises at least one diffusion frame and at least one connecting space portion
Implementation Method 2
at least one uniform flow structure... the uniform flow structure may be positioned within the bottom of the cavity... the airflow of the space can be uniformly output to a uniform airflow
Data Source
AI summary
The present invention discloses a laminar flow device which includes a housing defining a cavity, at least one air inlet, a diffusion device and at least one uniform flow structure. The at least one air inlet is positioned within the housing. The diffusion device is positioned within the housing, and the at least one uniform flow structure is positioned within the bottom of the cavity.