Laminar Gas Flow Filter With Opposed Diffusers for FAB Openings
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Solution Overview
Problem
In semiconductor manufacturing, maintaining environmental control in FAB spaces and equipment chambers is challenging due to the ingress and egress of semiconductor wafers, which can lead to contamination from airborne molecular contaminants and other factors.
Innovation Solution
A laminar gas flow filter and apparatus are designed to produce a laminar flow of gas, or air curtain, that covers the opening to a semiconductor FAB space or equipment chamber. This is achieved through a pair of diffuser tubes with gas inlets at opposite ends, which create a uniform gas flow velocity across the length of the filter, and an air filter module that can be selectively replaced.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a laminar gas flow filter is used to maintain environmental control, then contamination is reduced and VOC levels are lowered below 1000 ppbV, but the device complexity increases due to the need for diffuser tubes and air filter modules
Solution Approach 1:
The filter system is divided into multiple functional components: diffuser tubes for gas distribution and air filter modules for filtration. This segmentation allows each component to perform its specific function efficiently while enabling independent maintenance and replacement of the air filter modules without replacing the entire system.
Solution Approach 2:
The air filter modules utilize porous filtration materials to achieve effective contaminant removal and VOC reduction. The porous structure provides large surface area for filtration while maintaining gas flow, achieving low VOC levels below 1000 ppbV through physical filtration mechanisms.
2Stability of the object's composition
If diffuser tubes are used to create uniform gas flow velocity, then flow uniformity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The diffuser tube is divided into multiple gas inlet ports distributed along its length. This segmentation allows uniform gas introduction at multiple locations, creating consistent flow velocity across the filter surface without requiring extremely precise manufacturing tolerances for the entire tube structure.
Solution Approach 2:
The system utilizes controlled gas pressure and flow rate parameters to achieve uniform flow velocity. By adjusting operational parameters rather than relying solely on precise geometric dimensions, the system achieves flow uniformity with relaxed manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminar gas flow filter effectively maintains environmental control within semiconductor FAB spaces by reducing contamination and ensuring a clean, uniform gas flow, which can achieve VOC levels below 1000 ppbV and maintain other environmental control conditions.
Implementation Method 1
produce a laminar flow of gas, or air curtain, that covers the opening to a semiconductor FAB space or equipment chamber
Implementation Method 2
A first diffuser tube may be supplied a flow of gas under pressure... A second diffuser tube may be supplied a flow of gas under pressure
Data Source
AI summary
A method is provided for supporting environmental control in a semiconductor wafer processing space, the method includes: flowing a first gas under pressure in a first direction through a first diffuser tube, thereby generating a first lateral flow of gas through a sidewall of the first diffuser tube; flowing a second gas under pressure in a second direction through a second diffuser tube, thereby generating a second lateral flow of gas through a sidewall of the second diffuser tube, the second direction being opposite the first direction; combining the first and second lateral flows of gas within a housing; and outputting the combined lateral flows of gas from the housing to produce a laminar gas flow covering an opening to the semiconductor wafer processing space.