Laminate Adhesive Bonding and Thermal Conductivity
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Solution Overview
Problem
Existing laminates struggle to simultaneously achieve withstand voltage, thermal conductivity, and bonding strength, with forming an adhesive layer reducing thermal conductivity.
Innovation Solution
A laminate structure comprising a base material, a circuit, an insulating layer with a thermally conductive filler, and an adhesive that bonds the base material and insulating layer, while also filling spaces in the insulating layer to enhance bonding and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive layer is formed between the insulating layer and the base material to bond them firmly, then bonding strength is improved, but thermal conductivity deteriorates
Solution Approach 1:
The adhesive is applied locally only to specific bonding surfaces of the insulating layer rather than forming a continuous layer across the entire interface. This localized application provides sufficient bonding strength at critical areas while leaving other regions free for thermal conduction, thus resolving the contradiction between bonding strength and thermal conductivity.
Solution Approach 2:
The bonding interface is segmented into multiple discrete bonding surfaces rather than a continuous adhesive layer. The insulating layer includes multiple bonding surfaces distributed across its structure, and adhesive is applied only to these specific surfaces, allowing heat to conduct through non-bonded regions while maintaining structural integrity.
2Temperature
If the insulating layer contains filler to ensure thermal conductivity, then thermal conductivity is improved, but bonding strength deteriorates
Solution Approach 1:
The insulating layer is designed with spatially differentiated properties: regions with high filler content for thermal conductivity and regions with lower filler content or different composition for bonding. This local quality differentiation allows the same layer to simultaneously achieve both thermal conductivity and bonding strength without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate effectively satisfies withstand voltage, thermal conductivity, and bonding strength simultaneously, with the adhesive filling spaces in the insulating layer improving thermal conductivity and bonding.
Implementation Method 1
the adhesive fills at least a portion of the plurality of spaces
Implementation Method 2
The insulating layer contains filler, which ensures thermal conductivity of the insulating layer. By using such a laminate, heat that is generated in heating elements on the circuit and is transferred to the circuit is transferred to the base material through the insulating layer
Implementation Method 3
an adhesive configured to bond at least the base material and the insulating layer
Data Source
AI summary
A laminate includes: a base material; a circuit; an insulating layer provided between the base material and the circuit, the insulating layer including a thermally conductive filler; and an adhesive configured to bond at least the base material and the insulating layer. The base material and the insulating layer are bonded by the adhesive in part and in contact with each other in other parts. A plurality of spaces are formed in the insulating layer, and the adhesive fills at least a portion of the plurality of spaces.