Laminate Antenna Module for Multi-Band Coverage in Limited Space

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Solution Overview

Problem

Electronic devices face challenges in efficiently securing and optimizing the mounting space for antenna structures due to physical limitations, particularly in height, which affects radiation efficiency and the implementation of an optimum lamination structure for multiple frequency bands.

Innovation Solution

The electronic device incorporates a laminate antenna structure with a housing design featuring a first and second plate, a side member, a support member, a printed circuit board with a wireless communication circuit, and a processor. This structure includes conductive patches at a first layer, a shielding member at a second layer, and a dielectric between the layers, allowing for improved radiation efficiency and reduced physical space requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a patch antenna is designed to exhibit optimum radiation efficiency, then a specified height (or thickness) is required, but the mounting space height is limited making it difficult to implement an optimum lamination structure

Engineering Contradiction:
Improveradiation efficiencyVSAvoidmounting space height
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent transitions from a conventional single-layer antenna structure to a multi-layer lamination structure, utilizing the vertical dimension (height) more effectively. By stacking multiple conductive patches and dielectric layers, the antenna achieves the required electrical height for optimal radiation efficiency while maintaining a compact overall form factor that fits within limited mounting space constraints.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested lamination structure where multiple conductive patches and dielectric layers are stacked and integrated within a compact housing. Each layer is nested within the vertical space of the mounting area, allowing the antenna to achieve the necessary height for radiation efficiency while being contained within the limited overall height of the electronic device.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If multiple antennas are included to cover different frequency bands, then communication capability is improved, but mounting space requirements increase

Engineering Contradiction:
Improvefrequency band coverageVSAvoidmounting space
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent designs a multi-layer antenna structure where different conductive patches and layer configurations serve multiple frequency bands simultaneously. The same physical antenna structure performs multiple functions by radiating and receiving signals across LB, HB, and other frequency bands, eliminating the need for separate dedicated antennas for each band and thereby reducing the total mounting space required.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges multiple antenna functions into a single integrated lamination structure. By combining multiple conductive patches, dielectric layers, and grounding structures into one unified antenna module, the design achieves coverage for multiple frequency bands while occupying a compact mounting area, rather than requiring separate physical antennas for each frequency band.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20240030589A1Antenna module and electronic device comprising same
Publication Date: 2024.01.25 SAMSUNG ELECTRONICS CO LTD
  • US20240030589A1 patent drawing
  • US20240030589A1 patent drawing
  • US20240030589A1 patent drawing

AI summary

Disclosed is an electronic device including a housing, a support member, a printed circuit board, an antenna, and a processor. The antenna structure comprises: a first conductive patch disposed on a first layer and electrically connected to the first transmission line; a second conductive patch disposed to be spaced apart from the first conductive patch in the first layer and electrically connected to the second transmission line; a third conductive patch disposed spaced apart from the first conductive patch and the second conductive patch in the first layer and electrically connected to the third transmission line; and a shielding member disposed on the second layer, and the processor may be set to receive a wireless signal of a designated band by supplying power to the first conductive patch, the second conductive patch, and the third conductive patch by using a wireless communication circuit.