Laminate Electronic Component Plating Slits for Moisture Release
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Solution Overview
Problem
Existing laminate type electronic components face challenges in reducing the effective volume for capacitance due to thick paste electrode layers and moisture ingress issues during plating, which can lead to blister defects and reduced solderability.
Innovation Solution
The solution involves forming plating films with slits on the external electrodes that correspond to cuts in the internal electrodes' extending sections, allowing for moisture release and preventing blisters, while maintaining uniform external electrode surfaces for improved mountability through the use of upper plating films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If paste electrode layers are used to form external electrodes, then solderability is ensured, but the effective volume for capacitance is reduced due to the large thickness of paste electrode layers
Solution Approach 1:
The invention changes the material composition and structure of the external electrode by replacing the traditional thick paste electrode layer with a thin plating film layer. This parameter change in material structure allows the external electrode to maintain solderability while reducing thickness, thereby increasing the effective volume for capacitance.
Solution Approach 2:
The invention uses a thin plating film instead of a thick paste electrode layer, effectively replacing a bulky material with a thin-film material that serves the same functional purpose of providing solderability and electrical connection.
2Volume of stationary object
If plating films are formed directly on internal electrodes without paste electrode layers, then the effective volume for capacitance is increased, but moisture ingress occurs along the interface between internal electrodes and insulator layers
Solution Approach 1:
The invention changes the material parameters by using a plating film with specific thickness and composition that provides both electrical conductivity and moisture barrier properties, replacing the traditional paste electrode layer while preventing moisture ingress.
3Strength
If heat treatment is carried out at high temperature after plating to enhance fixing strength, then adhesion of plating films is improved, but blisters or bulge defects occur in the plating films due to trapped moisture
Solution Approach 1:
The invention performs a preliminary drying treatment before the high-temperature heat treatment to remove moisture from the component main body in advance. This preliminary action prevents moisture from causing blisters or bulge defects during the subsequent heat treatment, while still allowing the heat treatment to enhance the fixing strength of the plating films.
Solution Approach 2:
The invention introduces a preliminary drying step as a cushioning measure before the heat treatment that could cause blisters. This preliminary action cushions against the potential harm of moisture expansion during high-temperature treatment.
4Ease of manufacture
If plating films are formed directly on exposed ends of internal electrodes, then the manufacturing process is simplified, but the adhesion strength is insufficient compared to paste electrode layers
Solution Approach 1:
The invention changes the material parameters by using a plating film with optimized thickness and composition that provides sufficient adhesion strength while maintaining the simplified manufacturing process of direct plating without requiring thick paste electrode layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces moisture retention, prevents blister formation, and enhances solderability and alignment accuracy during reflow soldering by creating a more efficient path for moisture release and ensuring uniform plating films.
Implementation Method 1
plating films which are disposed directly on an outer surface of the component main body so as to be electrically connected to the plurality of internal electrodes
Implementation Method 2
a heat treatment may be carried out at a temperature on the order of 800° C. or more after the plating step. In this case, commonly, the moisture in the component main body will be removed by evaporation with the aid of the heat treatment
Data Source
AI summary
In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.