Laminate Compression Sequence to Prevent Ceramic Component Deformation
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Solution Overview
Problem
The process of compressing laminates for ceramic electronic components often results in deformation defects due to non-linear shrinkage phenomena, which can lead to cutting defects if the margin portion is insufficient.
Innovation Solution
A method involving a controlled compression process that includes pressurization at low temperature, subsequent temperature increase and maintenance, cooling, and depressurization, with a final temperature of the laminate ranging from 70° C. to 150° C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If compression is performed at high temperature and high pressure, then the laminate is sufficiently compressed for manufacturing, but deformation defects occur due to non-linear shrinkage phenomenon
Solution Approach 1:
The patent applies preliminary action by first pressurizing the laminate at low temperature (room temperature to 60°C) before heating. This preliminary pressurization at low temperature prevents non-linear shrinkage deformation that would occur if pressurization were applied directly at high temperature, while still achieving the necessary compression for manufacturing
Solution Approach 2:
The compression process is segmented into distinct stages: (1) pressurization at low temperature, (2) temperature increase while maintaining pressure, (3) maintaining compression at high temperature, and (4) cooling and depressurization. This segmentation allows each stage to serve its specific function, preventing deformation while achieving manufacturing goals
2Productivity
If compression is performed at high temperature, then the laminate achieves necessary compression, but non-linear shrinkage causes deformation that leads to cutting defects
Solution Approach 1:
The patent performs preliminary pressurization at low temperature before heating the laminate. This preliminary action establishes compression that prevents non-linear shrinkage deformation during subsequent heating, ensuring reliability and preventing cutting defects while maintaining productivity
Solution Approach 2:
The patent changes the temperature parameter during the compression process, specifically performing pressurization at low temperature (room temperature to 60°C) rather than at high temperature. This parameter change prevents non-linear shrinkage deformation while still achieving the necessary compression for productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses deformation defects caused by non-linear shrinkage, thereby reducing the occurrence of cutting defects and ensuring the quality of ceramic electronic components.
Implementation Method 1
pressurizing the laminate from a first pressure to a second pressure
Implementation Method 2
heating the laminate from a first temperature to a second temperature
Implementation Method 3
cooling the laminate from the second temperature to a third temperature
Implementation Method 4
a deformation defect of the laminate may occur due to a non-linear shrinkage phenomenon of the laminate
Data Source
AI summary
Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.