Laminate Electronic Device Carrier Recess Segmentation
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Solution Overview
Problem
Current methods for embedding semiconductor components into laminates face challenges in achieving low production costs, efficient electrical connections, and high versatility in circuit design and routing, particularly in portable electronic devices where size, thickness, and weight minimization are critical.
Innovation Solution
The method involves mounting semiconductor chips on a carrier with a recess structure, embedding them in an electrically insulating layer, and separating the carrier into parts along the recess pattern to form a laminate electronic device, which allows for efficient electrical connections and versatile circuit designs while minimizing size and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor chips are directly embedded into PCBs and build-up layers of SBU laminate substrates, then size and thickness are minimized, but production cost increases and manufacturing complexity increases
Solution Approach 1:
The device is divided into modular components: semiconductor chips mounted on a carrier substrate, which is then embedded into the laminate substrate. This segmentation allows independent optimization of chip mounting and laminate fabrication processes, reducing overall manufacturing complexity while achieving compact form factor
Solution Approach 2:
Semiconductor chips are pre-mounted on the carrier substrate before embedding into the laminate. This preliminary action enables separate optimization of chip assembly processes and laminate fabrication, reducing production costs while achieving miniaturization
2Volume of moving object
If semiconductor chips are directly embedded into PCBs and build-up layers of SBU laminate substrates, then size and thickness are minimized, but device complexity increases
Solution Approach 1:
The device structure is segmented into distinct functional modules: carrier substrate with mounted chips, embedding layer, and laminate substrate. This modular architecture simplifies the manufacturing process by allowing each module to be fabricated and assembled separately, reducing overall device complexity while maintaining compact dimensions
Solution Approach 2:
A carrier substrate is introduced as an intermediary component between the semiconductor chips and the laminate substrate. This intermediary simplifies the embedding process by providing a stable mounting platform for chips, thereby reducing manufacturing complexity while achieving miniaturization
3Adaptability or versatility
If semiconductor chips are mounted on a carrier with recess structure and embedded in electrically insulating layer, then electrical connections become efficient and circuit design versatility increases, but manufacturing process complexity increases
Solution Approach 1:
The carrier substrate incorporates localized recess structures at specific chip mounting positions, allowing optimized electrical connections and thermal management for each component location. This local customization enhances circuit design versatility while the standardized carrier design keeps overall manufacturing complexity manageable
Data Source
AI summary
A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.