Laminate Electronic Component External Electrode Plating
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Solution Overview
Problem
Existing methods for forming external electrodes in laminate type electronic components, such as those used in laminated ceramic capacitors, face challenges in efficiently applying batch treatments due to the need for precise masking and etching, which limits productivity and cost-effectiveness.
Innovation Solution
A method involving electrolytic plating with conductive particles like Pd, Pt, Cu, or Ag, arranged in island-shaped configurations, allows for the formation of a plating film as an external electrode, enabling batch treatment and efficient deposition only where needed, using a barrel plating method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conventional three-layer external electrode structure (paste electrode layer, first plating layer, second plating layer) is used, then solderability and protection against solder erosion are ensured, but the effective volume for capacitance is reduced due to the large thickness of the paste electrode layer
Solution Approach 1:
The invention extracts and removes the paste electrode layer from the external electrode structure, retaining only the plating layers. The conductive paste application and firing steps are eliminated, leaving a simplified two-layer structure (first plating layer and second plating layer) that provides both solderability and protection without the volumetric penalty of the paste layer.
Solution Approach 2:
The invention changes the compositional parameters of the external electrode by eliminating the organic binder and glass constituents of the paste electrode layer, retaining only the metallic plating layers. This parameter change reduces the electrode thickness from several tens to several hundreds of micrometers to merely several micrometers, thereby increasing the effective capacitance volume.
2Productivity
If electroless plating is used to form a metal thin film on the entire surface, then batch treatment can be efficiently applied, but masking-etching steps are required which cannot be handled by batch treatment, reducing productivity advantages
Solution Approach 1:
The invention applies preliminary action by forming the first plating layer (nickel) directly on the component main body surface before applying the second plating layer. This preliminary nickel plating layer serves as both a solder barrier and a base for the solderable tin or gold layer, eliminating the need for subsequent masking-etching operations to define electrode patterns.
Solution Approach 2:
The invention segments the plating process into two distinct batch-treatable steps: first forming the nickel barrier layer, then forming the tin or gold solderable layer. Each plating step can be independently optimized and performed using batch electroless plating methods, avoiding the need for complex masking-etching sequences.
3Reliability
If the paste electrode layer is used to electrically connect internal electrodes, then electrical connection is ensured, but the thickness of several tens to several hundreds of micrometers reduces the effective volume for capacitance
Solution Approach 1:
The invention extracts the electrical connection function from the thick paste electrode layer and transfers it to the thin plating layers. The nickel and tin/gold plating layers, with combined thickness of only several micrometers, provide sufficient electrical conductivity to connect internal electrodes while preserving maximum capacitance volume.
Solution Approach 2:
The invention uses composite metallic plating layers (nickel base layer with tin or gold top layer) to achieve both electrical conductivity and solderability in a thin structure. This composite approach replaces the paste electrode's metal-glass-organic composite with a more efficient metallic composite that provides equivalent or superior electrical connection with minimal thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the efficient formation of external electrodes with improved productivity and cost-effectiveness by ensuring plating growth only at desired regions, reducing damage to the laminated body and allowing for precise control over electrode placement.
Implementation Method 1
an external electrode forming step of forming, on the component main body, an external electrode electrically connected to the internal electrodes
Implementation Method 2
a metal thin film formed by an electroless plating method is used as an external electrode
Data Source
AI summary
In a method of manufacturing a laminate type electronic component, while the distance between adjacent exposed ends of a plurality of internal electrodes is adjusted preferably to be about 50 μm or less, a plurality of conductive particles composed of Pd, Pt, Cu, Au, or Ag are provided on the surface of a component main body. The conductive particles have an average particle size of about 0.1 nm to about 100 nm, which are distributed in island-shaped configurations over the entire surface of the component main body, while the average distance between the respective conductive particles is adjusted to fall within the range of about 10 nm to about 100 nm. The component main body is subjected to electrolytic plating such that plating growth develops in and around a region including the respective exposed ends of the plurality of internal electrodes.