Laminate Insulation Layer Stack for Bonding Strength and Alignment
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Solution Overview
Problem
In direct bonding technology using organic insulation materials, defects occur due to debris and surface unevenness, while adding inorganic fillers to reduce thermal expansion increases positional displacement and reduces bonding force.
Innovation Solution
A method involving a first insulation layer with inorganic oxide particles and a second insulation layer with minimal or no oxide particles, bonded to each other, to enhance bonding strength and prevent positional displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inorganic filler is added to organic insulation material to lower thermal expansion coefficient, then positional displacement is reduced, but bonding force between insulation layers is reduced
Solution Approach 1:
The patent divides the insulation structure into two distinct layers: a first insulation layer containing inorganic filler particles for thermal expansion control, and a second insulation layer free of inorganic filler for optimal bonding. This segmentation allows each layer to fulfill its specific function without compromise.
Solution Approach 2:
The patent applies different material compositions to different locations in the insulation structure. The first insulation layer (adjacent to semiconductor chip) contains inorganic filler for low thermal expansion, while the second insulation layer (outer layer) is filler-free for high bonding strength with external housings.
2Ease of manufacture
If organic insulation material is used instead of inorganic material, then cost is reduced and debris embedding ability is improved, but thermal expansion increases causing positional displacement
Solution Approach 1:
The patent creates a composite insulation structure combining organic insulation material with inorganic filler particles in the first layer. This composite approach maintains the cost and debris embedding advantages of organic materials while adding the thermal expansion control of inorganic fillers where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method increases bonding strength between insulation layers while preventing positional displacement and reducing thermal expansion, thereby improving the accuracy and reliability of the stack.
Implementation Method 1
since the organic insulation material is more likely to thermally expand than the inorganic insulation material and may cause positional displacement, it is considered that an inorganic filler is added to the organic insulation material to lower the thermal expansion coefficient of the insulation material
Data Source
AI summary
A method for manufacturing a stack, includes forming a first insulation layer on a first support substrate, the first insulation layer including a first thermosetting resin and first inorganic oxide particles; and bonding a first surface of the first insulation layer to a second surface of a second insulation layer including a second thermosetting resin. In this manufacturing method, the second insulation layer includes substantially no inorganic oxide particles or includes second inorganic oxide particles in a content smaller than that of the first inorganic oxide particles included in the first insulation layer.