Laminate Module Lid With Tamper Sensing and Thermal Conduction
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Solution Overview
Problem
Conventional hardware security modules face challenges in heat dissipation and structural rigidity when transitioning to a multi-chip module form factor, while also lacking tamper detection circuitry, which compromises security.
Innovation Solution
A thermally enhanced module lid designed with a laminate carrier-like structure that includes conductive adhesive bonding, embedded sensor circuitry for tamper detection, and thermal circuitry using solid copper structures to efficiently dissipate heat while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional hardware security modules use traditional plug-in card or external device form factors, then they provide adequate heat dissipation and structural rigidity, but they lack tamper detection circuitry and compromise security
Solution Approach 1:
The patent combines multiple functions into a single integrated module lid: thermal conduction structures for heat dissipation, sensor circuitry for tamper detection, and structural support functions. This merging of functions into one component resolves the contradiction by providing security features and thermal management without requiring separate complex subsystems.
Solution Approach 2:
The module lid is designed as a multi-functional component that simultaneously provides thermal conduction, structural support, and tamper detection capabilities. This universal design allows the single component to address multiple requirements (heat dissipation, security, structural integrity) without increasing overall device complexity.
2Volume of moving object
If hardware security modules transition to multi-chip module form factor to reduce size, then module size decreases, but heat dissipation capability and structural rigidity deteriorate
Solution Approach 1:
The module lid incorporates localized thermal conduction structures (such as copper heat sinks or thermally conductive pathways) specifically positioned to contact high-heat-generation areas of the multi-chip module. This local quality approach ensures effective heat dissipation from critical regions without requiring the entire module to be oversized for thermal management.
Solution Approach 2:
The lid employs composite material construction combining materials with different properties - such as metal components for thermal conduction, laminate materials for structural rigidity, and potentially polymer layers for insulation or sealing. This composite approach allows simultaneous optimization of thermal management and mechanical strength in a compact form factor.
3Volume of moving object
If hardware security modules transition to multi-chip module form factor to reduce size, then module size decreases, but structural rigidity deteriorates
Solution Approach 1:
The lid employs composite material construction combining materials with different properties - such as metal components for thermal conduction, laminate materials for structural rigidity, and potentially polymer layers for insulation or sealing. This composite approach allows simultaneous optimization of thermal management and mechanical strength in a compact form factor.
Solution Approach 2:
The lid may be designed as a multi-part assembly with segmented components that work together to provide structural support - such as a frame structure with reinforcing ribs or multiple bonded layers. This segmentation allows optimization of each part's function while maintaining overall rigidity in a compact design.
4Reliability
If sensor circuitry is embedded within the laminate carrier and module lid to provide continuous tamper detection, then security is enhanced, but device complexity increases
Solution Approach 1:
The sensor circuitry is integrated directly into the laminate carrier and module lid structures, merging the security detection function with existing structural components. This integration approach embeds traceable conductive pathways within the laminate layers and lid construction, allowing tamper detection without requiring separate discrete sensor components or additional complex circuit boards.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the size of hardware security modules, enhances security through continuous tamper detection, and ensures reliable heat management, preventing module failure and maintaining performance.
Implementation Method 1
a lid ring bonded to the laminate carrier with a conductive adhesive
Implementation Method 2
thermal circuitry comprising solid copper structures (thru vias) to thermally conduct heat from the electronic components
Implementation Method 3
a lid cover coupled to the lid ring with a conductive interconnect
Data Source
AI summary
A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.