Laminate Plate Thermal Expansion Control

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Solution Overview

Problem

Conventional laminate plates for semiconductor packages and printed wiring boards face challenges in achieving a low thermal expansion coefficient and high elastic modulus, leading to warping and cracking issues due to the limitations of existing methods such as high inorganic filler content, which affects insulation reliability and adhesiveness.

Innovation Solution

A laminate plate comprising a cured resin layer with an inorganic filler and a glass substrate layer, where the glass substrate accounts for 10-95% by volume, and the resin layer contains thermosetting resins and inorganic fillers like silica, which provides a low thermal expansion coefficient and high elastic modulus, preventing warping and cracking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the inorganic filler content is increased to lower the thermal expansion coefficient and increase the elastic modulus, then the thermal expansion coefficient is reduced and heat resistance is enhanced, but insulation reliability degrades and adhesiveness between resin and wiring layer fails

Engineering Contradiction:

Improvethermal expansion coefficientVSAvoidinsulation reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies parameter changes by precisely controlling the inorganic filler content within 5-50 vol% and adjusting the resin composition ratios (epoxy resin 40-80 parts, curing agent 10-30 parts) to optimize both thermal expansion coefficient reduction and insulation reliability maintenance

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining thermosetting resin with specific inorganic fillers (silica, alumina, talc, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, aluminum borate, or borosilicate glass) to create a laminate plate that achieves both low thermal expansion coefficient and high elastic modulus while maintaining insulation reliability

Inventive Principle:

Principle #40Composite materials

2Strength

If the inorganic filler content is increased to lower the thermal expansion coefficient and increase the elastic modulus, then the elastic modulus is enhanced, but pressing failure occurs in laminate plate production

Engineering Contradiction:

Improveelastic modulusVSAvoidpressing failure

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent applies parameter changes by controlling the inorganic filler content within 5-50 vol% and adjusting the resin composition ratios to ensure proper flowability and pressing characteristics, preventing pressing failure while achieving the desired elastic modulus enhancement

Inventive Principle:

Principle #35Parameter changes

3Temperature

If the crosslinking density of the resin is increased to reduce the thermal expansion coefficient, then the thermal expansion coefficient is lowered, but the molecular chain becomes too short and resin strength is reduced

Engineering Contradiction:

Improvethermal expansion coefficientVSAvoidresin strength

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The patent applies parameter changes by optimizing the crosslinking density through controlled curing agent addition (10-30 parts by mass) and resin composition ratios, achieving sufficient thermal expansion coefficient reduction while maintaining adequate molecular chain length and resin strength

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining thermosetting resin with inorganic fillers to achieve thermal expansion coefficient reduction without过度 crosslinking, as the inorganic filler provides thermal stability independent of resin crosslinking density

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces thermal expansion and enhances elastic modulus, preventing warping and cracking of the laminate plates, while maintaining high heat resistance and processability.

Implementation Method 1

the difference in the thermal expansion coefficient between the laminate plate used in a semiconductor package and the silicon chips to be mounted on the surface of the laminate plate

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

the elastic modulus of the laminate plate is low, for which, therefore, it may be effective to increase the elastic modulus of the laminate plate

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS9101061B2Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate

Publication Date: 2015.08.04 RESONAC CORP

AI summary

A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer includes a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer includes a cured product of the resin composition. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate including a cured resin layer forming step of forming the cured resin layer on the surface of a glass substrate.