Laminate Differential Pressure Sensor Package with Overmold and Dual Chimneys
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Solution Overview
Problem
Packaging of differential pressure sensors (DPS) poses challenges in small applications, particularly in accessing both sides of a membrane, which affects accuracy and implementation.
Innovation Solution
A laminate substrate-based sensor device with an overmold and lid design featuring air cavities and chimneys, allowing for efficient pressure measurement and protection of the transducer, while maintaining a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact packaging design is used for differential pressure sensors, then the device size is reduced, but accessing both sides of the membrane becomes difficult
Solution Approach 1:
The patent introduces vertical chimneys through the lid that provide access to the membrane from the top direction, enabling differential pressure measurement in a compact planar footprint. This vertical dimensionality allows both pressure ports to access the membrane without requiring lateral space, resolving the contradiction between compact size and ease of membrane access
2Measurement precision
If the transducer is exposed for pressure measurement, then pressure differential measurement accuracy is improved, but the transducer becomes vulnerable to environmental impacts
Solution Approach 1:
The patent introduces an overmold as an intermediary protective layer that seals around the transducer and ASIC die while maintaining pressure transmission pathways through the chimneys. This overmold shield protects the transducer from environmental contaminants, moisture, and physical damage while allowing accurate pressure measurement through the protected chimneys
3Object-affected harmful factors
If a protective enclosure is added around the transducer, then environmental protection is improved, but device complexity increases
Solution Approach 1:
The patent merges the protective enclosure function with the existing lid and overmold structures. The overmold integrates protection for both the transducer and ASIC die in a single molded component, while the lid with integrated chimneys provides structural protection and pressure access simultaneously. This merging approach provides comprehensive protection without proportionally increasing device complexity
Data Source
AI summary
The sensor device includes a substrate having upper and lower surfaces with a channel formed therebetween. First and second port holes are formed through the upper surface to the channel. The sensor device also includes an application-specific integrated circuit (ASIC) die mounted on the upper surface so as not to cover the first and second port holes. The sensor device further includes an overmolding formed on the upper surface that is molded over the ASIC die and forms first and second cavities surrounding the first and second port holes, respectively. The sensor device also includes a transducer electrically connected with the ASIC die and mounted within the first cavity on the upper surface so as to cover the first port hole. The sensor device further includes a lid attached to the overmolding having first and second chimneys.