Multilayer Laminate Release-Assisting Layer Thickness Ratio
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Solution Overview
Problem
Conventional laminates for printed wiring boards face challenges in maintaining release function across a wide temperature range, with release layers designed for specific temperatures losing effectiveness when heat-treated outside their adapted range, leading to issues with carrier-metal separation during manufacturing processes.
Innovation Solution
A laminate structure with a carrier, an adhesion layer, a release-assisting layer, and a metal layer, where the ratio of the release-assisting layer thickness to the adhesion layer thickness is controlled between 1 and 20, ensuring sustained release function across low and high temperature conditions through optimized diffusion behavior during heat treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a release layer is designed for low temperature heat treatment (e.g., 240°C), then the release function is effective at low temperature, but the release function decreases when heat treated at high temperature (e.g., 340°C)
Solution Approach 1:
The release layer is divided into multiple sub-layers with different materials, each optimized for specific temperature ranges. This segmentation allows the composite release layer to maintain release functionality across a broader temperature spectrum by combining the strengths of different materials.
Solution Approach 2:
The release layer uses composite material structure combining organic release layer and inorganic release layer. The organic layer provides release function at lower temperatures while the inorganic layer maintains release capability at higher temperatures, achieving broad temperature adaptability.
2Reliability
If a release layer is designed for high temperature heat treatment (e.g., 340°C), then the release function is effective at high temperature, but the release function decreases when heat treated at low temperature (e.g., 240°C)
Solution Approach 1:
The release layer is divided into multiple sub-layers with different materials, each optimized for specific temperature ranges. This segmentation allows the composite release layer to maintain release functionality across a broader temperature spectrum by combining the strengths of different materials.
Solution Approach 2:
The release layer uses composite material structure combining organic release layer and inorganic release layer. The organic layer provides release function at lower temperatures while the inorganic layer maintains release capability at higher temperatures, achieving broad temperature adaptability.
3Reliability
If the thickness of the release layer is increased to maintain release function, then the release function is improved, but it becomes difficult to maintain sufficient release function across wide temperature range from low to high temperature
Solution Approach 1:
The release layer uses composite material structure combining organic release layer and inorganic release layer. The organic layer provides release function at lower temperatures while the inorganic layer maintains release capability at higher temperatures, achieving broad temperature adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate maintains a desired release strength between 0.5 gf/cm and 200 gf/cm, enabling effective carrier-metal separation during heat treatment from 240°C to 340°C, thus addressing the limitations of conventional laminates by ensuring consistent releasability across a wide temperature range.
Implementation Method 1
ensuring sustained release function across low and high temperature conditions through optimized diffusion behavior during heat treatment
Data Source
AI summary
There is provided a laminate in which a decrease in the release function of a release layer can be suppressed even when the laminate is heat-treated under either temperature condition of low temperature and high temperature. This laminate includes a carrier; an adhesion layer on the carrier and containing a metal M1 having a negative standard electrode potential; a release-assisting layer on a surface of the adhesion layer opposite to the carrier and containing a metal M2 (M2 is a metal other than an alkali metal and an alkaline earth metal); a release layer on a surface of the release-assisting layer opposite to the adhesion layer; and a metal layer on a surface of the release layer opposite to the release-assisting layer, and T2/T1, a ratio of a thickness of the release-assisting layer, T2, to a thickness of the adhesion layer, T1, is more than 1 and 20 or less.