Laminate Bonding Resin Composition for High-Temperature Modulus
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Solution Overview
Problem
Conventional curable resin compositions used in laminates exhibit a significant decrease in elastic modulus at high temperatures when cured at low temperatures in a short time, which is inadequate for applications requiring high elastic modulus in high-temperature environments, such as automobile structural adhesives.
Innovation Solution
A method involving a curable resin composition containing epoxy resin and dicyandiamide, cured at 105°C to 145°C for 10 to 60 minutes, with a thickness ratio of the cured product to adherend thickness ranging from 0.5 to 10.0, to achieve a laminate with high elastic modulus in high-temperature environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If curable resin composition is cured at low temperature in a short time, then productivity is improved, but elastic modulus at high temperature significantly lowers
Solution Approach 1:
The invention changes the chemical composition parameters of the curable resin system by selecting specific epoxy resins (A, B, C) with different structures and properties, and combining them with dicyandiamide in controlled ratios. This parameter optimization enables the resin to achieve both fast curing at low temperature and high elastic modulus retention at elevated temperatures
Solution Approach 2:
The invention uses a composite resin system combining three different epoxy resins (aliphatic polybasic acid-modified, alicyclic, and phenolic resin-modified) with dicyandiamide hardener. This composite material approach allows the system to exhibit both rapid cure kinetics and superior high-temperature mechanical properties that individual components cannot achieve alone
2Use of energy by stationary object
If curing temperature is reduced, then energy consumption decreases, but elastic modulus at high temperature decreases
Solution Approach 1:
The invention optimizes the chemical composition parameters of the resin system to enable low-temperature curing while maintaining high-temperature performance. The specific ratio of epoxy resins (A, B, C) and dicyandiamide creates a curing system that achieves full cure at lower temperatures, reducing energy consumption while preserving elastic modulus
Solution Approach 2:
Dicyandiamide acts as an intermediary curing agent that enables the epoxy resin system to cure at lower temperatures compared to conventional hardeners. This intermediary chemical mechanism allows low-temperature processing while the resulting crosslinked structure maintains high elastic modulus at service temperatures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a laminate with a cured product that maintains high elastic modulus in high-temperature conditions, suitable for automobile structural adhesives even when cured at low temperatures in a short time.
Implementation Method 1
curing the curable resin composition (curing step), the curable resin composition containing an epoxy resin (A), and dicyandiamide (B)
Data Source
AI summary
A method for producing a laminate that is obtained by bonding an adherend with a cured product having a high elastic modulus in a high-temperature environment even in a case where low-temperature curing is carried out, is provided. The method for producing a laminate includes the steps of applying a curable resin composition having a specific composition to a first adherend and bonding the first adherend with a second adherend, and subjecting the curable resin composition to low-temperature curing. The laminate has a ratio of a thickness of the cured product and an average thickness of those adherends in a specific range.