Laminate Sheet Sealing for SAW Chip Heat Dissipation
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Solution Overview
Problem
Existing methods for sealing SAW chips with thermally conductive materials in resin sheets fail to efficiently dissipate heat generated by the SAW chip, particularly as electronic component integration increases, leading to frequency fluctuations and reduced long-term performance.
Innovation Solution
A manufacturing method involving a laminate sheet with a first thermal-conductive layer and a second thermal-conductive layer, where the first layer has higher thermal conductivity in the thickness direction and the second layer has higher conductivity in the principal surface direction, is used to seal the SAW chip, allowing for effective heat dissipation by maintaining a space between the chip and the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thermally conductive material is blended in a resin sheet for sealing the SAW chip, then heat dissipation is facilitated, but the heat generated inside the SAW chip cannot dissipate quickly via the resin sheet to the substrate
Solution Approach 1:
The resin sheet is divided into multiple layers with different thermal conductivity characteristics. The first resin sheet has higher thermal conductivity in the thickness direction ( toward the substrate) to efficiently conduct heat away from the SAW chip, while the second resin sheet has higher thermal conductivity in the principal surface direction to dissipate heat laterally. This segmentation allows each layer to optimize its thermal conduction path for its specific function, resolving the contradiction between heat dissipation efficiency and reliability.
Solution Approach 2:
The invention uses a composite structure of multiple resin sheets with different thermal conductivity anisotropy characteristics. By combining materials with different thermal properties in a layered configuration, the system achieves both rapid heat extraction toward the substrate and effective lateral heat distribution, thereby simultaneously improving heat dissipation efficiency and long-term operational reliability.
2Productivity
If electronic components are integrated and densified on the circuit board, then device functionality is enhanced, but heat dissipation of the SAW chip becomes increasingly difficult
Solution Approach 1:
The resin sheets are designed with spatially varying thermal conductivity properties tailored to specific directional needs. The first resin sheet provides high thermal conductivity in the thickness direction specifically at the interface with the substrate for efficient heat extraction, while the second resin sheet provides high thermal conductivity in the principal surface direction for lateral heat distribution. This local optimization of thermal properties enables effective heat management in high-density integrated devices.
3Reliability
If the SAW chip is sealed with a resin sheet, then the chip is protected, but the space between the chip and circuit board cannot be maintained
Solution Approach 1:
The sealing structure transitions from a single-layer approach to a multi-layer configuration, adding the dimensional aspect of layered construction. This allows the sealing function to be distributed across multiple interfaces while maintaining the air gap space through the combined thickness and structural design of the layered resin sheets, thereby preserving both protection and spacing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances heat dissipation performance by ensuring heat is quickly transmitted from the SAW chip to the circuit board, improving the long-term reliability and stability of the SAW chip's operation.
Implementation Method 1
the first thermal-conductive layer after curing has a coefficient of thermal conductivity in a thickness direction at room temperature being equal to or greater than a coefficient of thermal conductivity in a principal surface direction, and the second thermal-conductive layer after curing has a coefficient of thermal conductivity in a principal surface direction at room temperature being greater than a coefficient of thermal conductivity in a thickness direction
Data Source
AI summary
A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a laminate sheet including a first thermal-conductive layer and a second thermal-conductive layer, the first thermal-conductive layer disposed at least on one outermost side; a disposing step of disposing the laminate sheet on the mounting member such that the first thermal-conductive layer faces the second circuit members; and a sealing step of pressing the laminate sheet against the first circuit member and heating the laminate sheet, to seal the second circuit members so as to maintain the space, and to cure the laminate sheet. The first thermal-conductive layer after curing has a coefficient of thermal conductivity in a thickness direction at room temperature being equal to or greater than that in a principal surface direction, and the second thermal-conductive layer after curing has a coefficient of thermal conductivity in a principal surface direction at room temperature being greater than that in a thickness direction.