Laminate Substrate Cutting Sequence to Prevent Edge Chipping
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Solution Overview
Problem
Existing methods for cutting laminate substrates with different materials result in edge chipping defects and require substrate reversal, leading to potential damage and increased processing time.
Innovation Solution
A processing method involving a substrate cutting blade and a metal cutting blade, where the laminate substrate is held in place and cut along scheduled division lines, with the substrate blade forming initial grooves, followed by the metal blade cutting the intermediate layer, and finally the substrate blade dividing the second substrate, without reversing the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If one kind of cutting blade is used to cut the laminate substrate, then the cutting process is simplified, but marked defects called chipping occur at edges of cut grooves
Solution Approach 1:
The cutting process is segmented into three distinct steps using different blades: first substrate cutting blade for outer substrates, second substrate cutting blade for intermediate layer, and third substrate cutting blade for final substrate division. This segmentation allows each blade to be optimized for its specific material, preventing chipping while maintaining process control.
Solution Approach 2:
Different cutting blades with specific properties are applied to different regions of the laminate substrate based on material composition. The first substrate cutting blade is used where silicon substrate cutting is needed, the second blade where metal intermediate layer cutting is needed, and the third blade for final substrate division, ensuring optimal cut quality for each local material type.
2Ease of operation
If substrate reversal is performed for further processing, then all layers can be accessed for cutting, but the substrate may be damaged at the time of reversion
Solution Approach 1:
Instead of reversing the substrate to access different layers, the method inverts the approach by using a support member on the second substrate side and performing all cutting operations from the first substrate side. This eliminates the need for substrate reversal while still allowing access to all layers through the support member configuration.
Solution Approach 2:
A support member is introduced as an intermediary element placed on the second substrate side to provide stable support during cutting operations. This mediator allows the cutting blade to access and cut the intermediate layer and second substrate without requiring the substrate to be reversed, thereby preventing damage while maintaining operational ease.
3Manufacturing precision
If substrate reversal is performed for further processing, then complete cutting of all layers is possible, but processing time increases
Solution Approach 1:
The support member is preliminarily disposed on the second substrate side before cutting operations begin. This preliminary setup enables all subsequent cutting operations to be performed from one side without interruption for substrate reversal, completing the cutting of all layers in a continuous process and reducing overall processing time.
Solution Approach 2:
The cutting process maintains continuity by performing all three cutting steps (first substrate, intermediate layer, and second substrate cutting) in sequence from the same side of the laminate without interruption for substrate reversal. This continuous operation eliminates downtime associated with repositioning and ensures complete cutting of all layers efficiently.
Data Source
AI summary
A laminate substrate is divided along a plurality of intersecting scheduled division lines. The laminate substrate has a first substrate and a second substrate formed of the same material, laminated through an intermediate layer containing metal. The laminate substrate is divided by cutting the laminate substrate along the scheduled division lines by use of a substrate cutting blade to form the first substrate with first cut grooves each having a width larger than a cutting edge thickness of a metal cutting blade which is larger in cutting edge thickness than the substrate cutting blade, and thereafter cutting the laminate substrate along the first cut grooves by use of the metal cutting blade to cut the intermediate layer and to form second cut grooves each having a width corresponding to the cutting edge thickness of the metal cutting blade.