Laminate Substrate Power Supply Shielding
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Solution Overview
Problem
High-frequency devices for multiband wireless communications face interference issues due to the close proximity of electrode patterns on laminate substrates, particularly with increased integration of power supply lines and signal lines, which hinders miniaturization without compromising high-frequency characteristics.
Innovation Solution
The high-frequency device is designed with power supply lines sandwiched between a pair of ground electrodes on a laminate substrate, separating them from signal lines and allowing for flexible arrangement, thereby preventing interference and enabling miniaturization while maintaining high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high-frequency-signal-treating circuits are integrated on a laminate substrate, then device miniaturization is achieved, but interference between power supply lines and signal lines occurs
Solution Approach 1:
The patent divides the laminate substrate into distinct functional layers: a power supply line layer dedicated to power distribution and signal line layers for high-frequency signals. This segmentation separates power supply lines from signal lines in the vertical direction, preventing interference while maintaining device miniaturization.
Solution Approach 2:
The patent resolves the interference problem by transitioning from horizontal separation to vertical separation. Power supply lines and signal lines are arranged on different layers (different vertical dimension) of the laminate substrate, eliminating interference while achieving miniaturization in the planar direction.
2Adaptability or versatility
If the number of high-frequency-signal-treating circuits is increased, then device functionality is improved, but interference between power supply lines and signal lines increases
Solution Approach 1:
The patent implements segmentation by creating a dedicated power supply line layer separate from signal line layers. This allows multiple high-frequency-signal-treating circuits to be integrated without increasing interference, as power supply lines are vertically separated from signal lines regardless of the number of circuits.
Solution Approach 2:
By arranging power supply lines on a separate layer in the vertical dimension, the patent enables increased device functionality through additional circuits without proportionally increasing interference. The vertical separation maintains isolation even as circuit density increases.
3Volume of moving object
If electrode patterns are placed closer together, then device miniaturization is achieved, but interference between electrode patterns occurs
Solution Approach 1:
The patent resolves the interference issue by utilizing the vertical dimension through multi-layer construction. Electrode patterns that would interfere when placed close together in the planar direction are instead separated vertically across different layers, enabling miniaturization without sacrificing performance.
Solution Approach 2:
The patent segments the substrate into multiple functional layers, placing different types of electrode patterns (power supply, ground, signal) on separate layers. This segmentation prevents interference even when patterns are closely spaced in the planar view.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses interference between power supply lines and signal lines, allowing for the miniaturization of high-frequency devices without degrading their high-frequency characteristics, suitable for complex communications apparatuses.
Implementation Method 1
a first ground electrode arranged on the side of the main surface with respect to the power supply line layer, overlapping at least part of the power supply lines in a lamination direction, and a second ground electrode arranged on the opposite side of the first ground electrode with respect to the power supply line layer, overlapping at least part of the power supply lines in a lamination direction
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A high-frequency device having high-frequency-signal-treating circuits in and on a laminate substrate comprising pluralities of dielectric layers having conductor patterns, the high-frequency-signal-treating circuits having amplifier circuits and switch circuits; terminals including input and output terminals of high-frequency signals, the power supply terminals of the amplifier circuits and the power supply terminals of the switch circuits being formed on one main surface of the laminate substrate; power supply lines each having one end connected to each of the power supply terminals of the amplifier circuits and power supply lines each having one end connected to each of the power supply terminals of the switch circuits being formed on one dielectric layer to constitute a power supply line layer; a first ground electrode being arranged on the side of the main surface with respect to the power supply line layer, the first ground electrode overlapping at least part of the power supply lines in a lamination direction; a second ground electrode being arranged on the opposite side of the first ground electrode with respect to the power supply line layer, the second ground electrode overlapping at least part of the power supply lines in a lamination direction; and the high-frequency-signal-treating circuits being arranged on the opposite side of the power supply line layer with respect to the second ground electrode.