Laminate Structure for Substrate Warp Suppression
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Solution Overview
Problem
Existing methods for manufacturing electronic devices face challenges with substrate warpage, leading to adsorption failures and reduced manufacturing yield, particularly when using thin glass or metal foils, as they are difficult to stabilize and fix during the process.
Innovation Solution
A laminate structure comprising a support base material, an adhesive layer, and a substrate with a dielectric multilayer film is used, where the dielectric multilayer film has alternating layers with different refractive indices and is designed to peelably adhere to the adhesive layer, allowing for stable fixation and easy peeling, thereby eliminating warpage issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a dielectric single layer film is disposed on the other surface of the substrate to suppress warp, then the warp can be suppressed, but it takes much time and labor to additionally produce the dielectric single layer film, causing a large load on the process
Solution Approach 1:
A support base material is introduced as an intermediary component between the substrate and the manufacturing environment. This support base material provides mechanical stability and suppresses substrate warp without requiring additional dielectric film deposition steps, thereby maintaining manufacturing efficiency while achieving warp suppression
Solution Approach 2:
The invention creates a composite structure consisting of the support base material and the substrate with dielectric multilayer film. This composite configuration allows the support base material to mechanically stabilize the substrate and suppress warp, eliminating the need for additional dielectric single layer film production while maintaining the functional dielectric multilayer film
2Weight of moving object
If the glass substrate is made thinner to make devices thinner and lighter, then the device can be thinner and lighter, but the amount of warp is increased
Solution Approach 1:
The support base material acts as a counterbalancing element that provides mechanical support to the thin substrate. It counteracts the inherent warping forces in thin substrates through its structural rigidity and bonding, enabling the use of thinner substrates for lighter devices while maintaining dimensional stability
3Weight of moving object
If a substrate with large warp is used in the process for forming the member for an electronic device, then the substrate may be difficult to adsorb, but using a thinner substrate reduces device weight
Solution Approach 1:
The support base material serves as a mediator that provides a stable adsorption surface for the thin substrate. It enables reliable adsorption of the substrate during the member formation process while allowing the use of thinner, lighter substrates, thus resolving the conflict between device weight reduction and adsorption stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables stable adsorption and fixation of substrates, improving the manufacturing yield of electronic devices by addressing warpage-related issues and facilitating the peeling process without damaging the substrate or dielectric multilayer film.
Implementation Method 1
the dielectric multilayer film includes two or more kinds of dielectric layers, each of the dielectric multilayers has different refractive index and the dielectric multilayers are laminated alternately
Implementation Method 2
a support base material, an adhesive layer and a substrate that are provided in this order
Data Source
AI summary
The present invention provides a laminate that can eliminate adsorption defects of a substrate caused by warping of the substrate and enables electronic devices to be manufactured at high yield. The present invention pertains to a laminate that is provided with a support base material, an adhesion layer, and a substrate in said order. The substrate is provided with a dielectric multilayer film in which dielectric layers having different refractive indexes are alternately laminated on an outer surface of the substrate. The substrate provided with the dielectric multilayer film is disposed on the adhesion layer such that the dielectric multilayer film adheres in a peelable manner to the adhesion layer.